The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 11, 2021
Filed:
Aug. 28, 2019
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 25/065 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); B29C 43/18 (2006.01); B29C 43/36 (2006.01); B29L 31/34 (2006.01); B29K 63/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/0657 (2013.01); B29C 43/18 (2013.01); B29C 43/36 (2013.01); H01L 21/565 (2013.01); H01L 21/568 (2013.01); H01L 25/50 (2013.01); B29C 2043/181 (2013.01); B29K 2063/00 (2013.01); B29L 2031/3481 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06582 (2013.01);
Abstract
Methods for fabricating microelectronic device assemblies, the method comprising providing mutually spaced stacks of microelectronic devices on a substrate and substantially concurrently encapsulating the stacks of microelectronic devices on the substrate and gang bonding mutually aligned conductive elements of vertically adjacent microelectronic devices. Compression molding apparatus for implementing the methods, and resulting microelectronic device assemblies are also disclosed.