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For the Inventor, By the Inventor

Boise, ID, United States of America

Brandon P Wirz

LinkedIn
USPTO Granted Patents = 41 

Average Co-Inventor Count = 2.5

ph-index = 3

Forward Citations = 35(Granted Patents)


Location History:

  • Kuna, ID (US) (2015 - 2018)
  • Taichung, TW (2023)
  • Boise, ID (US) (2018 - 2024)

Company Filing History:

goldMedal41 out of 37,905 
 
Micron Technology Incorporated
 patents

Years Active: 2015-2025

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41 patents (USPTO):Explore Patents
1. 12406847 - Microelectronic devices and related methods of fabricating microelectronic devices (2025-09-02),
2. 12251841 - Apparatuses for handling microelectronic devices (2025-03-18),
3. 12148727 - Semiconductor device assembly with die support structures (2024-11-19),
4. 12100661 - Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods (2024-09-24),
5. 12087720 - Semiconductor device assembly with surface-mount die support structures (2024-09-10),
6. 12087697 - Semiconductor devices with recessed pads for die stack interconnections (2024-09-10),
7. 11961818 - Substrates with heat transfer structures for bonding a stack of microelectronic devices, and related assemblies and electronic systems (2024-04-16),
8. 11955345 - Encapsulation warpage reduction for semiconductor die assemblies and associated methods and systems (2024-04-09),
9. 11911904 - Apparatus and methods for enhanced microelectronic device handling (2024-02-27),
10. 11908828 - Contaminant control in thermocompression bonding of semiconductors and associated systems and methods (2024-02-20),
11. 11791212 - Thin die release for semiconductor device assembly (2023-10-17),
12. 11784092 - Disposing protective cover film and underfill layer over singulated integrated circuit dice for protection during integrated circuit processing (2023-10-10),
13. 11784050 - Method of fabricating microelectronic devices and related microelectronic devices, tools, and apparatus (2023-10-10),
14. 11776908 - Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods (2023-10-03),
15. 11764096 - Method for semiconductor die edge protection and semiconductor die separation (2023-09-19),

Title: The Innovative Journey of Brandon P Wirz

Introduction: Brandon P Wirz, a talented inventor hailing from Boise, ID, has made significant contributions to the field of innovations with his creative mindset and dedication to problem-solving.

Latest Patents: Brandon P Wirz holds several patents in various technological areas, showcasing his versatility and ingenuity in inventing new solutions to complex problems.

Career Highlights: Throughout his career, Brandon P Wirz has demonstrated a keen ability to identify gaps in the market and develop groundbreaking inventions to fill those voids. His passion for innovation has led to the creation of several successful products that have positively impacted industries.

Collaborations: Brandon P Wirz has collaborated with leading research institutions and universities to further his inventions and bring them to market. His ability to work with diverse teams and experts has enhanced the quality and impact of his innovations.

Conclusion: Brandon P Wirz's journey as an inventor is a testament to his unwavering commitment to pushing the boundaries of what is possible through innovation. His inventive spirit and dedication continue to inspire others in the field, making him a true pioneer in the world of inventions.

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