The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 16, 2024
Filed:
Aug. 05, 2022
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Andrew M. Bayless, Boise, ID (US);
Brandon P. Wirz, Boise, ID (US);
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 25/065 (2023.01); H01L 25/18 (2023.01);
U.S. Cl.
CPC ...
H01L 24/75 (2013.01); H01L 24/81 (2013.01); H01L 25/0657 (2013.01); H01L 25/18 (2013.01); H01L 2224/16221 (2013.01); H01L 2224/16238 (2013.01); H01L 2224/75263 (2013.01); H01L 2224/81203 (2013.01); H01L 2224/81224 (2013.01); H01L 2225/06517 (2013.01);
Abstract
This patent application relates to methods and apparatus for temperature modification within a stack of microelectronic devices for mutual collective bonding of the microelectronic devices, and to related substrates and assemblies.
Quick Actions:
Bayless, Andrew. (2024). Substrates with heat transfer structures for bonding a stack of microelectronic devices, and related assemblies and electronic systems (U.S. Patent No. 11961818). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11961818
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile