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Andrew M Bayless

This inventor holds 38 USPTO granted patents and 24 published patent applications, primarily in Semiconductor Devices. Top assignee: Micron Technology Incorporated. Active years: 2017-2026.

USPTO Granted Patents = 38 (Patent Applications = 24)

% Patents Active = 97.4

Average Co-Inventor Count = 2.2

ph-index = 2

Forward Citations = 29(Granted Patents)

Company Filing History:

38 out of 39,125

Micron Technology Incorporated

patents

Years Active: 2017-2026

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Areas of Expertise:

Semiconductor Device Assembly

Chip-On-Wafer Processing

Microelectronic Devices

Die Edge Protection

Thin Die Release

Heat Transfer Structures

Bonding Techniques

Wafer Handling

Recessed Semiconductor Devices

Temperature Modification

Carrier Removal

Cooling Systems

38 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12622304 - Semiconductor device assembly interconnection pillars and associated methods (2026-05-05),

2. 12543607 - Separation method and assembly for chip-on-wafer processing (2026-02-03),

3. 12512368 - Thin die release for semiconductor device assembly (2025-12-30),

4. 12506118 - Perpendicular semiconductor device assemblies and associated methods (2025-12-23),

5. 12406847 - Microelectronic devices and related methods of fabricating microelectronic devices (2025-09-02),

6. 12100661 - Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods (2024-09-24),

7. 12087697 - Semiconductor devices with recessed pads for die stack interconnections (2024-09-10),

8. 11961818 - Substrates with heat transfer structures for bonding a stack of microelectronic devices, and related assemblies and electronic systems (2024-04-16),

9. 11791212 - Thin die release for semiconductor device assembly (2023-10-17),

10. 11784092 - Disposing protective cover film and underfill layer over singulated integrated circuit dice for protection during integrated circuit processing (2023-10-10),

11. 11784050 - Method of fabricating microelectronic devices and related microelectronic devices, tools, and apparatus (2023-10-10),

12. 11776908 - Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods (2023-10-03),

13. 11764096 - Method for semiconductor die edge protection and semiconductor die separation (2023-09-19),

14. 11715696 - Semiconductor devices with recessed pads for die stack interconnections (2023-08-01),

15. 11676955 - Separation method and assembly for chip-on-wafer processing (2023-06-13),

Title: The Innovative Journey of Andrew M Bayless

Introduction: Andrew M Bayless, a talented inventor based in Boise, ID (US), has made significant contributions to the field of innovations with his creative mindset and dedication to problem-solving.

Latest Patents: Andrew M Bayless holds several patents in various industries, showcasing his versatility and expertise in inventing cutting-edge solutions to complex challenges.

Career Highlights: Throughout his career, Andrew M Bayless has demonstrated a keen ability to transform ideas into tangible inventions that have the potential to revolutionize the way we live and work. His innovative spirit and passion for creating have led to the development of groundbreaking technologies.

Collaborations: Andrew M Bayless has collaborated with leading research institutions, universities, and companies to further enhance his inventions and bring them to the market. His collaborative efforts have resulted in successful partnerships that have propelled his innovations to new heights.

Conclusion: Andrew M Bayless stands as a beacon of creativity and ingenuity in the world of inventions, inspiring others to push the boundaries of what is possible. His dedication to innovation and his relentless pursuit of excellence continue to shape the future of technology and beyond.

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