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For the Inventor, By the Inventor

Boise, ID, United States of America

Andrew M Bayless

LinkedIn
USPTO Granted Patents = 34 

Average Co-Inventor Count = 2.2

ph-index = 2

Forward Citations = 25(Granted Patents)


Company Filing History:

goldMedal34 out of 37,905 
 
Micron Technology Incorporated
 patents

Years Active: 2017-2025

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34 patents (USPTO):Explore Patents
1. 12406847 - Microelectronic devices and related methods of fabricating microelectronic devices (2025-09-02),
2. 12100661 - Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods (2024-09-24),
3. 12087697 - Semiconductor devices with recessed pads for die stack interconnections (2024-09-10),
4. 11961818 - Substrates with heat transfer structures for bonding a stack of microelectronic devices, and related assemblies and electronic systems (2024-04-16),
5. 11791212 - Thin die release for semiconductor device assembly (2023-10-17),
6. 11784092 - Disposing protective cover film and underfill layer over singulated integrated circuit dice for protection during integrated circuit processing (2023-10-10),
7. 11784050 - Method of fabricating microelectronic devices and related microelectronic devices, tools, and apparatus (2023-10-10),
8. 11776908 - Semiconductor die edge protection for semiconductor device assemblies and associated systems and methods (2023-10-03),
9. 11764096 - Method for semiconductor die edge protection and semiconductor die separation (2023-09-19),
10. 11715696 - Semiconductor devices with recessed pads for die stack interconnections (2023-08-01),
11. 11676955 - Separation method and assembly for chip-on-wafer processing (2023-06-13),
12. 11646269 - Recessed semiconductor devices, and associated systems and methods (2023-05-09),
13. 11515171 - Methods and apparatus for temperature modification and reduction of contamination in bonding stacked microelectronic devices (2022-11-29),
14. 11410961 - Methods and apparatus for temperature modification in bonding stacked microelectronic components and related substrates and assemblies (2022-08-09),
15. 11289360 - Methods and apparatus for protection of dielectric films during microelectronic component processing (2022-03-29),

Title: The Innovative Journey of Andrew M Bayless

Introduction: Andrew M Bayless, a talented inventor based in Boise, ID (US), has made significant contributions to the field of innovations with his creative mindset and dedication to problem-solving.

Latest Patents: Andrew M Bayless holds several patents in various industries, showcasing his versatility and expertise in inventing cutting-edge solutions to complex challenges.

Career Highlights: Throughout his career, Andrew M Bayless has demonstrated a keen ability to transform ideas into tangible inventions that have the potential to revolutionize the way we live and work. His innovative spirit and passion for creating have led to the development of groundbreaking technologies.

Collaborations: Andrew M Bayless has collaborated with leading research institutions, universities, and companies to further enhance his inventions and bring them to the market. His collaborative efforts have resulted in successful partnerships that have propelled his innovations to new heights.

Conclusion: Andrew M Bayless stands as a beacon of creativity and ingenuity in the world of inventions, inspiring others to push the boundaries of what is possible. His dedication to innovation and his relentless pursuit of excellence continue to shape the future of technology and beyond.

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