Pei Sian Shao

Title: Pei Sian Shao: Innovator in Semiconductor Technology

Introduction

Pei Sian Shao is a notable inventor based in Taichung, Taiwan. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative approach to microelectronic device assemblies.

Latest Patents

His latest patents include "Semiconductor die assemblies with sidewall protection and associated methods and systems." This invention discloses a semiconductor die assembly that features an interface die with a low-k dielectric layer and a stack of semiconductor dies attached to it. The assembly is designed with a molding structure that protects the sidewalls of both the interface die and the semiconductor dies. Additionally, the assembly may include a passivation layer that is coplanar with the outer sidewall surface of the molding structure. Another significant patent is "Methods and apparatus for integrated gang bonding and encapsulation of stacked microelectronic devices." This patent outlines methods for fabricating microelectronic device assemblies, which involve providing spaced stacks of devices on a substrate and encapsulating them while gang bonding aligned conductive elements.

Career Highlights

Pei Sian Shao is currently employed at Micron Technology Incorporated, where he continues to advance semiconductor technology. His work has been instrumental in developing innovative solutions that enhance the performance and reliability of microelectronic devices.

Collaborations

Throughout his career, Pei has collaborated with talented individuals such as Bradley R Bitz and Yu Lin Kao, who contribute to the dynamic environment of innovation at Micron Technology.

Conclusion

Pei Sian Shao's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence the development of advanced microelectronic devices.