Methods and electronic system assemblies for a printed circuit board over printed circuit board assembly

Abstract

A method and an electronic system assembly that includes a first circuit substrate having a surface, wherein the surface has a two-dimensional area defined in a first dimension and a second dimension; a plurality of first semiconductor chip packages mounted on and electrically coupled to the surface; a plurality of second circuit substrates positioned over the surface, wherein each first semiconductor chip package is arranged between the surface and a respective second circuit substrate in a third dimension; a plurality of conductive interconnect structures that extend in the third dimension, wherein the plurality of conductive interconnect structures are provided in a plurality of interconnect groups, and wherein each interconnect group connects a different second circuit substrate to the first circuit substrate; and a plurality of second semiconductor chip packages, wherein each second semiconductor chip package is mounted and electrically coupled to a respective second circuit substrate.