The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 24, 2026

Filed:

Aug. 24, 2022
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

Charles E. Siko, Boise, ID (US);

Kaleb A. Wilson, Caldwell, ID (US);

Bradley R. Bitz, Boise, ID (US);

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/40 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01); H01L 25/00 (2006.01); H01L 25/065 (2023.01); H05K 1/02 (2006.01); H05K 1/18 (2006.01); H05K 1/183 (2026.01);
U.S. Cl.
CPC ...
H01L 23/40 (2013.01); H01L 23/4006 (2013.01); H01L 23/49811 (2013.01); H01L 24/92 (2013.01); H01L 25/0655 (2013.01); H05K 1/183 (2013.01); H01L 2023/4062 (2013.01); H01L 2023/4087 (2013.01); H01L 24/16 (2013.01); H01L 24/32 (2013.01); H01L 24/48 (2013.01); H01L 24/73 (2013.01); H01L 25/50 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/48225 (2013.01); H01L 2224/73253 (2013.01); H05K 1/0271 (2013.01); H05K 2201/06 (2013.01); H05K 2201/09136 (2013.01);
Abstract

A printed wiring board assembly is disclosed that includes a printed wiring board with a first side and a second side opposite first side. Magnet structures are in physical contact with the printed wiring board and a microelectronic device component is coupled to the first side of the printed wiring board. A heat spreader overlies and is in thermal communication with the microelectronic device component, and posts are coupled to the heat spreader and horizontally neighbor the microelectronic device component, where the posts are in magnetic communication with the magnet structures. Related methods and electronic systems are also disclosed.


Find Patent Forward Citations

Siko, Charles. (2026). Heat spreader apparatus with magnetic attachments on printed wiring board assemblies, related methods and electronic systems (U.S. Patent No. 12564051). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12564051

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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