Yeow Chon Ong

Title: Innovations of Yeow Chon Ong

Introduction

Yeow Chon Ong is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. He holds a total of four patents, showcasing his expertise and innovative spirit in the field.

Latest Patents

One of his latest patents is titled "Conductive adhesive assembly for semiconductor die attachment." This invention relates to various semiconductor device assemblies and includes an adhesive assembly configured for semiconductor die attachment, featuring one or more adhesive films and conductive elements embedded within them. Another significant patent is "Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devices." This patent describes a semiconductor package assembly that includes a substrate and a die stack, which consists of a bottom die, an inert top spacer, and a first inert base spacer. The design aims to enhance solder joint reliability in semiconductor devices.

Career Highlights

Yeow Chon Ong is currently employed at Micron Technology Incorporated, where he continues to innovate and contribute to advancements in semiconductor technology. His work has had a significant impact on the industry, particularly in improving the reliability and efficiency of semiconductor devices.

Collaborations

He has collaborated with notable coworkers, including Hong Wan Ng and Faxing Che, further enhancing the innovative environment at Micron Technology.

Conclusion

Yeow Chon Ong's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in semiconductor device assemblies and reliability.