The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 07, 2025
Filed:
Aug. 18, 2022
Applicant:
Micron Technology, Inc., Boise, ID (US);
Inventors:
Ramesh Nallavelli, Sangareddy, IN;
Nagavenkata Varaprasad Nune, Hyderabad, IN;
Yeow Chon Ong, Toa Payoh, SG;
Hong Wan Ng, Singapore, SG;
Assignee:
Micron Technology, Inc., Boise, ID (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); C09J 9/02 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); C09J 9/02 (2013.01); H01L 24/29 (2013.01); H01L 25/0652 (2013.01); H01L 25/0657 (2013.01); C09J 2203/326 (2013.01); C09J 2301/314 (2020.08); H01L 24/13 (2013.01); H01L 24/16 (2013.01); H01L 24/73 (2013.01); H01L 2224/13193 (2013.01); H01L 2224/16145 (2013.01); H01L 2224/29013 (2013.01); H01L 2224/29076 (2013.01); H01L 2224/2908 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/29193 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/73204 (2013.01); H01L 2225/06513 (2013.01); H01L 2225/06524 (2013.01); H01L 2924/07811 (2013.01); H01L 2924/07812 (2013.01); H01L 2924/1434 (2013.01);
Abstract
Implementations described herein relate to various semiconductor device assemblies. In some implementations, an adhesive assembly configured for semiconductor die attachment includes one or more adhesive films capable of semiconductor die attachment, and one or more conductive elements embedded in the one or more adhesive films.