The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 31, 2026
Filed:
Aug. 30, 2022
Micron Technology, Inc., Boise, ID (US);
Hong Wan Ng, Singapore, SG;
Seng Kim Ye, Singapore, SG;
Kelvin Aik Boo Tan, Singapore, SG;
Chin Hui Chong, Singapore, SG;
Micron Technology, Inc., Boise, ID (US);
Abstract
Methods, systems, and devices for multi-chip package with enhanced conductive layer adhesion are described. In some examples, a conductive layer (e.g., a conductive trace) may be formed above a substrate. An integrated circuit may be bonded to the conductive layer and an encapsulant may be deposited at least between the integrated circuit and the conductive layer. In some examples, one or more surface features or one or more recesses may be formed on or within the conductive layer and the encapsulant may adhere to the surface features or recesses.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile