Choon Kuan Lee

This inventor holds 71 USPTO granted patents and 3 published patent applications and 4 EPO patents, primarily in Microelectronic Packaging (CPC class H01L). Top assignee: Micron Technology Incorporated. Active years: 2004-2025.

USPTO Granted Patents = 71 (Patent Applications = 3)

% Patents Active = 91.5

EPO Patents = 4 (Patent Applications = 1)

Average Co-Inventor Count = 3.2

ph-index = 14

Forward Citations = 925(Granted Patents)

Forward Citations (Not Self Cited) = 883(Dec 10, 2025)

Inventors with similar research interests:

Company Filing History:

71 out of 39,125

Micron Technology Incorporated

patents

Years Active: 2004-2025

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Areas of Expertise:

Integrated Circuit

Microelectronic Devices

Stacked Devices

Build-Up Package

Lead Frames

Conductive Vias

Interposer Structure

Semiconductor Packaging

Device Assemblies

Manufacturing Methods

Redistribution Elements

Face-to-Face Dice

71 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12315769 - Build-up package for integrated circuit devices, and methods of making same (2025-05-27),

2. 11367667 - Build-up package for integrated circuit devices, and methods of making same (2022-06-21),

3. 11239128 - Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices (2022-02-01),

4. 11189548 - Pre-encapsulated lead frames for microelectronic device packages, and associated methods (2021-11-30),

5. 10593607 - Build-up package for integrated circuit devices, and methods of making same (2020-03-17),

6. 10448509 - Electronic device assemblies including conductive vias having two or more conductive elements (2019-10-15),

7. 10431513 - Microelectronic devices, stacked microelectronic devices, and methods for manufacturing microelectronic devices (2019-10-01),

8. 10211114 - Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices (2019-02-19),

9. 10008468 - Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices (2018-06-26),

10. 9768121 - Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices (2017-09-19),

11. 9721874 - Pre-encapsulated lead frames for microelectronic device packages, and associated methods (2017-08-01),

12. 9640458 - Stacked microelectronic devices (2017-05-02),

13. 9530748 - Packaged microelectronic devices and methods for manufacturing packaged microelectronic devices (2016-12-27),

14. 9362260 - Stacked packaged integrated circuit devices, and methods of making same (2016-06-07),

15. 9362141 - Microelectronic devices, stacked microelectronic devices, and methods for manufacturing such devices (2016-06-07),

Title: Choon Kuan Lee - Pioneering Inventor from Singapore

Introduction: Choon Kuan Lee is a highly respected inventor hailing from Singapore, known for his groundbreaking contributions to various technological fields.

Latest Patents: Choon Kuan Lee holds several patents in the areas of electronics, telecommunications, and renewable energy, showcasing his innovative mindset and forward-thinking approach.

Career Highlights: With a career spanning over two decades, Choon Kuan Lee has worked with leading tech companies and research institutions, consistently pushing the boundaries of what is possible in the world of innovation.

Collaborations: Throughout his career, Choon Kuan Lee has collaborated with top engineers, scientists, and researchers from around the globe, fostering a culture of creativity and excellence in all his projects.

Conclusion: Choon Kuan Lee's passion for innovation and his relentless pursuit of technological advancement continue to inspire the next generation of inventors and entrepreneurs worldwide.