The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Oct. 15, 2019

Filed:

Jul. 13, 2015
Applicant:

Micron Technology, Inc., Boise, ID (US);

Inventors:

David J. Corisis, Nampa, ID (US);

Choon Kuan Lee, Singapore, SG;

Chin Hui Chong, Singapore, SG;

Assignee:

Micron Technology, Inc., Boise, ID (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H05K 1/16 (2006.01); H05K 3/10 (2006.01); H05K 3/42 (2006.01); H05K 3/46 (2006.01); H01L 21/02 (2006.01); H01L 21/44 (2006.01); H01L 21/48 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); G01R 31/02 (2006.01); H05K 1/02 (2006.01); H01L 21/768 (2006.01); H01L 23/498 (2006.01); H01L 23/66 (2006.01); G06F 1/16 (2006.01); H05K 1/18 (2006.01);
U.S. Cl.
CPC ...
H05K 1/115 (2013.01); G01R 31/026 (2013.01); G06F 1/16 (2013.01); H01L 21/486 (2013.01); H01L 21/76898 (2013.01); H01L 23/481 (2013.01); H01L 23/49827 (2013.01); H01L 23/66 (2013.01); H05K 1/0221 (2013.01); H05K 1/0251 (2013.01); H05K 1/0296 (2013.01); H05K 1/18 (2013.01); H01L 2223/6616 (2013.01); H01L 2223/6638 (2013.01); H01L 2924/0002 (2013.01); H01L 2924/09701 (2013.01); H01L 2924/3011 (2013.01); H05K 1/0245 (2013.01); H05K 3/42 (2013.01); H05K 3/429 (2013.01); H05K 2201/09236 (2013.01); H05K 2201/09672 (2013.01); H05K 2201/09809 (2013.01); Y10T 29/49165 (2015.01);
Abstract

Electronic devices include a substrate with first and second pairs of conductive traces extending in or on the substrate. A first conductive interconnecting member extends through a hole in the substrate and communicates electrically with a first trace of each of the first and second pairs, while a second conductive interconnecting member extends through the hole and communicates electrically with the second trace of each of the first and second pairs. The first and second interconnecting members are separated from one another by a distance substantially equal to a distance separating the conductive traces in each pair. Electronic device assemblies include a transmitting device configured to transmit a differential signal through a conductive structure to a receiving device. The conductive structure includes first and second pair of conductive traces with first and second interconnecting members providing electrical communication therebetween.


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