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Chia-Lin Yu

This inventor holds 37 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Technology. Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., TSMC Solid State Lighting Ltd., Epistar Corporation. Active years: 2011-2023.

USPTO Granted Patents = 37 (Patent Applications = 2)

% Patents Active = 73.0

Average Co-Inventor Count = 5.2

ph-index = 6

Forward Citations = 131(Granted Patents)

Location History:

Sigang Township, Tainan County, TW (2011 - 2013)
Tainan, TW (2013 - 2014)
Sigang, TW (2011 - 2015)
Tainan County, TW (2019)
Sigang Township, TW (2013 - 2023)

Company Filing History:

30 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

patents

4 out of 117

TSMC Solid State Lighting Ltd.

Years Active: 2011-2023

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Areas of Expertise:

Through-Silicon Vias

Light-Emitting Devices

III-V Epitaxy

Semiconductor Packaging

Textured Substrate

Noise Reduction

CMOS Devices

Stress-Alleviation Layer

Conductive Tunneling Layer

Wafer Thinning

Nitridation Treatment

LED Structures

37 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11545392 - Semiconductor component having through-silicon vias (2023-01-03),

2. 10784162 - Method of making a semiconductor component having through-silicon vias (2020-09-22),

3. 10497619 - Method of manufacturing a semiconductor device including through silicon plugs (2019-12-03),

4. 10115634 - Semiconductor component having through-silicon vias and method of manufacture (2018-10-30),

5. 10062821 - Light-emitting device (2018-08-28),

6. 10049931 - Method of manufacturing a semiconductor device including through silicon plugs (2018-08-14),

7. 9698325 - Light-emitting device including reflective layer (2017-07-04),

8. 9418923 - Semiconductor component having through-silicon vias and method of manufacture (2016-08-16),

9. 9373755 - Light-emitting diodes on concave texture substrate (2016-06-21),

10. 9305864 - Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuit (2016-04-05),

11. 9287440 - Method of manufacturing a semiconductor device including through silicon plugs (2016-03-15),

12. 9214613 - Method of forming light-generating device including reflective layer (2015-12-15),

13. 9130115 - Light-emitting diode with textured substrate (2015-09-08),

14. 8946742 - Semiconductor package with through silicon vias (2015-02-03),

15. 8878252 - III-V compound semiconductor epitaxy from a non-III-V substrate (2014-11-04),

Title: Chia-Lin Yu: Innovator in Semiconductor Technologies

Introduction: Chia-Lin Yu, an accomplished inventor based in Sigang, Taiwan, holds a remarkable portfolio of 37 patents. His innovations primarily focus on advancements in semiconductor components and manufacturing methods, highlighting his significant contributions to the field of technology.

Latest Patents: Among his latest patents, Chia-Lin Yu has developed a groundbreaking semiconductor component that incorporates through-silicon vias. This design features a substrate with an opening and a layered structure comprising a first and second dielectric liner, each exhibiting different thicknesses and stress orientations. Additionally, he has patented methods for creating these semiconductor components, which involve precise etching and layering techniques to enhance performance and reliability.

Career Highlights: Chia-Lin Yu has built an impressive career, notably with institutions such as Taiwan Semiconductor Manufacturing Company Ltd. and TSMC Solid State Lighting Ltd. His work at these leading companies has enabled him to drive significant advancements in semiconductor technology.

Collaborations: Throughout his career, Chia-Lin Yu has collaborated with notable professionals in the field, including Chen-Hua Douglas Yu and Wen-Chih Chiou. These partnerships have fostered an environment of innovation, propelling forward his research and development efforts.

Conclusion: Chia-Lin Yu stands out as a prominent figure in the semiconductor industry, with a substantial number of patents that reflect his innovative spirit and technical expertise. His ongoing contributions to semiconductor technology continue to influence the landscape of modern electronics, showcasing the importance of creativity and collaboration in achieving groundbreaking advancements.

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