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For the Inventor, By the Inventor

Sigang, Taiwan

Chia-Lin Yu

USPTO Granted Patents = 37 

Average Co-Inventor Count = 5.2

ph-index = 6

Forward Citations = 131(Granted Patents)


Location History:

  • Sigang Township, Tainan County, TW (2011 - 2013)
  • Tainan, TW (2013 - 2014)
  • Sigang, TW (2011 - 2015)
  • Tainan County, TW (2019)
  • Sigang Township, TW (2013 - 2023)

Company Filing History:

goldMedal30 out of 40,635 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents
silverMedal4 out of 117 
 
TSMC Solid State Lighting Ltd.
 patents
bronzeMedal3 out of 1,221 
 
Epistar Corporation
 patents

Years Active: 2011-2023

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37 patents (USPTO):
1. 11545392 - Semiconductor component having through-silicon vias (2023-01-03),
2. 10784162 - Method of making a semiconductor component having through-silicon vias (2020-09-22),
3. 10497619 - Method of manufacturing a semiconductor device including through silicon plugs (2019-12-03),
4. 10115634 - Semiconductor component having through-silicon vias and method of manufacture (2018-10-30),
5. 10062821 - Light-emitting device (2018-08-28),
6. 10049931 - Method of manufacturing a semiconductor device including through silicon plugs (2018-08-14),
7. 9698325 - Light-emitting device including reflective layer (2017-07-04),
8. 9418923 - Semiconductor component having through-silicon vias and method of manufacture (2016-08-16),
9. 9373755 - Light-emitting diodes on concave texture substrate (2016-06-21),
10. 9305864 - Through silicon via (TSV) isolation structures for noise reduction in 3D integrated circuit (2016-04-05),
11. 9287440 - Method of manufacturing a semiconductor device including through silicon plugs (2016-03-15),
12. 9214613 - Method of forming light-generating device including reflective layer (2015-12-15),
13. 9130115 - Light-emitting diode with textured substrate (2015-09-08),
14. 8946742 - Semiconductor package with through silicon vias (2015-02-03),
15. 8878252 - III-V compound semiconductor epitaxy from a non-III-V substrate (2014-11-04),

Title: Chia-Lin Yu: Innovator in Semiconductor Technologies

Introduction: Chia-Lin Yu, an accomplished inventor based in Sigang, Taiwan, holds a remarkable portfolio of 37 patents. His innovations primarily focus on advancements in semiconductor components and manufacturing methods, highlighting his significant contributions to the field of technology.

Latest Patents: Among his latest patents, Chia-Lin Yu has developed a groundbreaking semiconductor component that incorporates through-silicon vias. This design features a substrate with an opening and a layered structure comprising a first and second dielectric liner, each exhibiting different thicknesses and stress orientations. Additionally, he has patented methods for creating these semiconductor components, which involve precise etching and layering techniques to enhance performance and reliability.

Career Highlights: Chia-Lin Yu has built an impressive career, notably with institutions such as Taiwan Semiconductor Manufacturing Company Ltd. and TSMC Solid State Lighting Ltd. His work at these leading companies has enabled him to drive significant advancements in semiconductor technology.

Collaborations: Throughout his career, Chia-Lin Yu has collaborated with notable professionals in the field, including Chen-Hua Douglas Yu and Wen-Chih Chiou. These partnerships have fostered an environment of innovation, propelling forward his research and development efforts.

Conclusion: Chia-Lin Yu stands out as a prominent figure in the semiconductor industry, with a substantial number of patents that reflect his innovative spirit and technical expertise. His ongoing contributions to semiconductor technology continue to influence the landscape of modern electronics, showcasing the importance of creativity and collaboration in achieving groundbreaking advancements.

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