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Chi-Cheng Hung

This inventor holds 72 USPTO granted patents, primarily in Semiconductor Manufacturing (CPC class H01L). Top assignees: Taiwan Semiconductor Manufacturing Comp. Ltd., Lyontek Inc., Winbond Electronics Corporation. Active years: 1998-2025.

USPTO Granted Patents = 72

% Patents Active = 87.5

Average Co-Inventor Count = 3.9

ph-index = 6

Forward Citations = 199(Granted Patents)

Forward Citations (Not Self Cited) = 182(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Hsinchu, TW (1998 - 2019)
Toufen Township, Miaoli County, TW (2012 - 2020)
Miaoli County, TW (2016 - 2021)
Tainan, TW (1999 - 2024)
Toufen Township, TW (2013 - 2024)

Company Filing History:

65 out of 42,679

Taiwan Semiconductor Manufacturing Comp. Ltd.

Winbond Electronics Corporation

patents

4. 1 out of 1

Cheertek Incorporation

patent

Years Active: 1998-2025

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Areas of Expertise:

FinFET Structures

Semiconductor Device

Contact Plugs

Critical Dimension Uniformity

Tantalum Nitride

Pattern Fidelity

Metal Gate

Electroplating

Dielectric Spacer

Self-Anneal Strain

Dual-Chip Package

Lithographic Techniques

72 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12507458 - Semiconductor device with dielectric spacer liner on source/drain contact (2025-12-23),

2. 12356656 - FinFET structures and methods of forming the same (2025-07-08),

3. 12068197 - Methods for forming contact plugs with reduced corrosion (2024-08-20),

4. 12065731 - Tungsten deposition on a cobalt surface (2024-08-20),

5. 12021147 - FinFET structures and methods of forming the same (2024-06-25),

6. 11955379 - Metal adhesion layer to promote metal plug adhesion (2024-04-09),

7. 11901188 - Method for improved critical dimension uniformity in a semiconductor device fabrication process (2024-02-13),

8. 11670690 - Semiconductor device with dielectric spacer liner on source/drain contact (2023-06-06),

9. 11616132 - Semiconductor device and methods of manufacture (2023-03-28),

10. 11563120 - FinFET structures and methods of forming the same (2023-01-24),

11. 11289338 - Method for improved critical dimension uniformity in a semiconductor device fabrication process (2022-03-29),

12. 11271103 - Semiconductor device and manufacturing process thereof (2022-03-08),

13. 11158509 - Pattern fidelity enhancement with directional patterning technology (2021-10-26),

14. 11133395 - N-work function metal with crystal structure (2021-09-28),

15. 11043573 - Method of fabricating tantalum nitride barrier layer and semiconductor device thereof (2021-06-22),

Title: The Inventor Spotlight: Chi-Cheng Hung

Introduction: Chi-Cheng Hung, a brilliant inventor hailing from Tainan, Taiwan, has left an indelible mark in the world of innovation with his groundbreaking work in semiconductor devices. Holding an impressive portfolio of 67 patents, Chi-Cheng Hung's contributions continue to shape the future of technology.

Latest Patents: Among his latest patents is the 'Metal adhesion layer to promote metal plug adhesion', which revolutionizes metal plug formation by enhancing adhesion through plasma modification. Additionally, his 'Method for improved critical dimension uniformity in a semiconductor device fabrication process' showcases his expertise in optimizing semiconductor manufacturing processes for superior precision.

Career Highlights: Chi-Cheng Hung has honed his skills and expertise at renowned companies such as Taiwan Semiconductor Manufacturing Company Limited and Winbond Electronics Corporation. His innovative spirit and dedication have led to numerous breakthroughs in the semiconductor industry, cementing his status as a key figure in technological advancement.

Collaborations: Throughout his career, Chi-Cheng Hung has collaborated closely with esteemed colleagues such as Yu-Sheng Wang and Wei-Liang Lin. Together, they have contributed significantly to the development of cutting-edge technologies and solutions, pushing the boundaries of innovation.

Conclusion: In conclusion, Chi-Cheng Hung stands as a true visionary in the world of inventions, with his pioneering work continuing to inspire future generations of inventors and innovators. His relentless pursuit of excellence and commitment to innovation have solidified his reputation as a trailblazer in the field of semiconductor devices, shaping the landscape of technology for years to come.

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