The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 20, 2024
Filed:
Jan. 21, 2021
Applicant:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Inventors:
Chi-Cheng Hung, Tainan, TW;
Pei-Wen Wu, Hsinchu, TW;
Yu-Sheng Wang, Tainan, TW;
Pei-Shan Chang, Taipei, TW;
Assignee:
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/033 (2006.01); C23C 16/02 (2006.01); C23C 16/06 (2006.01); H01L 21/02 (2006.01); H01L 29/34 (2006.01); H01L 29/66 (2006.01);
U.S. Cl.
CPC ...
C23C 16/06 (2013.01); C23C 16/0281 (2013.01); H01L 21/02425 (2013.01); H01L 21/0332 (2013.01); H01L 29/34 (2013.01); H01L 29/66795 (2013.01);
Abstract
In some implementations, one or more semiconductor processing tools may deposit cobalt material within a cavity of the semiconductor device. The one or more semiconductor processing tools may polish an upper surface of the cobalt material. The one or more semiconductor processing tools may perform a hydrogen soak on the semiconductor device. The one or more semiconductor processing tools may deposit tungsten material onto the upper surface of the cobalt material.