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For the Inventor, By the Inventor

Hsinchu, Taiwan

Cheng Kun Tsai

USPTO Granted Patents = 16

Average Co-Inventor Count = 7.2

ph-index = 7

Forward Citations = 240(Granted Patents)


Company Filing History:

goldMedal16 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2013-2022

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16 patents (USPTO):Explore Patents
1. 11308256 - Method of post optical proximity correction (OPC) printing verification by machine learning (2022-04-19),
2. 11048161 - Optical proximity correction methodology using pattern classification for target placement (2021-06-29),
3. 10747938 - Method for integrated circuit manufacturing (2020-08-18),
4. 10691864 - Method of post optical proximity correction (OPC) printing verification by machine learning (2020-06-23),
5. 10527928 - Optical proximity correction methodology using pattern classification for target placement (2020-01-07),
6. 10520829 - Optical proximity correction methodology using underlying layer information (2019-12-31),
7. 10360339 - Method for integrated circuit manufacturing (2019-07-23),
8. 9418191 - Providing electron beam proximity effect correction by simulating write operations of polygonal shapes (2016-08-16),
9. 9390217 - Methodology of optical proximity correction optimization (2016-07-12),
10. 9262578 - Method for integrated circuit manufacturing (2016-02-16),
11. 8683392 - Double patterning methodology (2014-03-25),
12. 8631360 - Methodology of optical proximity correction optimization (2014-01-14),
13. 8627241 - Pattern correction with location effect (2014-01-07),
14. 8527916 - Dissection splitting with optical proximity correction to reduce corner rounding (2013-09-03),
15. 8464186 - Providing electron beam proximity effect correction by simulating write operations of polygonal shapes (2013-06-11),

Title: Cheng Kun Tsai: Innovator in Integrated Circuit Design and Manufacturing

Introduction: Cheng Kun Tsai is a distinguished inventor based in Hsinchu, Taiwan, known for his innovative contributions to the field of integrated circuits (IC). With a remarkable portfolio of 16 patents, his work has significantly advanced the methodologies used in optical proximity correction and machine learning applications within semiconductor fabrication.

Latest Patents: Among his latest innovations, Cheng has developed a groundbreaking method of post optical proximity correction (OPC) printing verification utilizing machine learning. This method involves receiving an IC design layout, performing optical proximity correction to produce a corrected layout, and then verifying this layout through a machine learning algorithm. The process ensures that the corrected IC design is accurately produced by identifying its features and validating them against a comprehensive database. Additionally, he has pioneered optical proximity correction methodologies that employ pattern classification for improving target placement in lithography printability. This method also involves generating target points based on a classification model of the IC pattern, ultimately enhancing the accuracy of the mask fabrication process.

Career Highlights: Cheng Kun Tsai currently works at Taiwan Semiconductor Manufacturing Company Ltd., an influential leader in the semiconductor industry. His role involves applying his extensive expertise in semiconductor design and manufacturing to innovate and streamline production processes. His contributions have not only bolstered the company's technological capabilities but also reinforced its position as a frontrunner in the global market.

Collaborations: In his journey of innovation, Cheng has collaborated with notable peers, including Wen-Chun Huang and Hung-Chun Wang. Together, they have worked on several projects to enhance IC design processes, facilitating advancements in technology and improving production efficiency at their company.

Conclusion: Cheng Kun Tsai's contributions to the field of integrated circuit design through innovative patents highlight his impact on the semiconductor industry. His work, characterized by a commitment to leveraging machine learning and advanced optical proximity correction techniques, is poised to shape the future of semiconductor manufacturing and technology advancement.

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