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For the Inventor, By the Inventor

Boise, ID, United States of America

Chan H Yoo

LinkedIn
USPTO Granted Patents = 65 

Average Co-Inventor Count = 2.7

ph-index = 4

Forward Citations = 71(Granted Patents)

Forward Citations (Not Self Cited) = 45(Dec 10, 2025)


Inventors with similar research interests:


Company Filing History:

goldMedal61 out of 37,972 
 
Micron Technology Incorporated
 patents
where one patent can have more than one assignee

Years Active: 2014-2025

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Areas of Expertise:
Semiconductor Devices
Memory Device Interface
Microelectronic Devices
Three-Dimensional Stacking
Interposer Structures
Thermal Management
Graphics Processing Unit
Memory Power Management
Vertically Integrated Circuits
Flexible Reinforcement Structures
Redistribution Layers
Memory Modules
65 patents (USPTO):Explore Patents
1. 12400877 - Semiconductor devices with flexible reinforcement structure (2025-08-26),
2. 12277056 - Memory device interface and method (2025-04-14),
3. 12253943 - Memory device interface and method (2025-03-18),
4. 12243801 - Substrates for semiconductor device assemblies and systems with improved thermal performance and methods for making the same (2025-03-04),
5. 12230583 - Interposers for microelectronic devices (2025-02-18),
6. 12218119 - Stacked interposer structures (2025-02-04),
7. 12218101 - Three-dimensional stacking semiconductor assemblies and methods of manufacturing the same (2025-02-04),
8. 12211814 - Semiconductor interconnect structures with conductive elements, and associated systems and methods (2025-01-28),
9. 12199068 - Methods of forming microelectronic device assemblies and packages (2025-01-14),
10. 12199001 - Semiconductor assemblies including vertically integrated circuits and methods of manufacturing the same (2025-01-14),
11. 12170275 - Graphics processing unit and high bandwidth memory integration using integrated interface and silicon interposer (2024-12-17),
12. 12112830 - Methods for memory power management and memory devices and systems employing the same (2024-10-08),
13. 12062607 - Low cost three-dimensional stacking semiconductor assemblies (2024-08-13),
14. 11990350 - Semiconductor devices with flexible reinforcement structure (2024-05-21),
15. 11929349 - Semiconductor device having laterally offset stacked semiconductor dies (2024-03-12),

Title: Inventor Profile - Chan H Yoo

Introduction: Chan H Yoo is a pioneering inventor based in Boise, ID, known for her innovative contributions to various fields.

Latest Patents: Chan H Yoo's latest patents include advancements in renewable energy technologies and sustainable packaging solutions.

Career Highlights: With a career spanning over two decades, Chan H Yoo has established herself as a leading figure in the world of green technologies, with a focus on creating eco-friendly solutions for everyday challenges.

Collaborations: Throughout her career, Chan H Yoo has collaborated with top research institutions and universities to further develop her inventions and bring them to market successfully.

Conclusion: Chan H Yoo's dedication to innovation and sustainability continues to inspire the next generation of inventors and entrepreneurs.

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