The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jan. 14, 2025
Filed:
Aug. 05, 2022
Micron Technology, Inc., Boise, ID (US);
Owen R. Fay, Meridian, ID (US);
Randon K. Richards, Kuna, ID (US);
Aparna U. Limaye, Boise, ID (US);
Dong Soon Lim, Boise, ID (US);
Chan H. Yoo, Boise, ID (US);
Bret K. Street, Meridian, ID (US);
Eiichi Nakano, Boise, ID (US);
Shijian Luo, San Diego, CA (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
Disclosed is a microelectronic device assembly comprising a substrate having conductors exposed on a surface thereof. Two or more microelectronic devices are stacked on the substrate, each microelectronic device comprising an active surface having bond pads operably coupled to conductive traces extending over a dielectric material to via locations beyond at least one side of the stack, and vias extending through the dielectric materials at the via locations and comprising conductive material in contact with at least some of the conductive traces of each of the two or more electronic devices and extending to exposed conductors of the substrate. Methods of fabrication and related electronic systems are also disclosed.