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For the Inventor, By the Inventor

Boise, ID, United States of America

Eiichi Nakano

USPTO Granted Patents = 35 

Average Co-Inventor Count = 1.8

ph-index = 4

Forward Citations = 74(Granted Patents)


Company Filing History:

goldMedal33 out of 37,972 
 
Micron Technology Incorporated
 patents
where one patent can have more than one assignee

Years Active: 2018-2025

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35 patents (USPTO):Explore Patents
1. 12437832 - Repair techniques for coupled memory dies (2025-10-07),
2. 12424574 - Polymer coated semiconductor devices and hybrid bonding to form semiconductor assemblies (2025-09-23),
3. 12362311 - Anisotropic conductive film with carbon-based conductive regions having void space and related semiconductor device assemblies and methods (2025-07-15),
4. 12300622 - Device packages including redistribution layers with carbon-based conductive elements, and methods of fabrication (2025-05-13),
5. 12278202 - Modular construction of hybrid-bonded semiconductor die assemblies and related systems and methods (2025-04-14),
6. 12243610 - Memory with parallel main and test interfaces (2025-03-04),
7. 12237299 - Systems and methods for direct bonding in semiconductor die manufacturing (2025-02-25),
8. 12199068 - Methods of forming microelectronic device assemblies and packages (2025-01-14),
9. 12051670 - Use of pre-channeled materials for anisotropic conductors (2024-07-30),
10. 11915997 - Thermal management of GPU-HBM package by microchannel integrated substrate (2024-02-27),
11. 11881468 - Anisotropic conductive film with carbon-based conductive regions and related semiconductor device assemblies and methods (2024-01-23),
12. 11817420 - Systems and methods for direct bonding in semiconductor die manufacturing (2023-11-14),
13. 11791315 - Semiconductor assemblies including thermal circuits and methods of manufacturing the same (2023-10-17),
14. 11749608 - Device packages including redistribution layers with carbon-based conductive elements, and methods of fabrication (2023-09-05),
15. 11621257 - Wafer-scale memory techniques (2023-04-04),

Title: **Eiichi Nakano: Innovator in Semiconductor Technology**

Introduction

Eiichi Nakano is a notable inventor based in Boise, ID, with an impressive portfolio consisting of 30 patents. His contributions to the field of semiconductor technology have been significant, focusing on memory systems and their operational efficiencies.

Latest Patents

Among his latest patents, Nakano has developed innovative methods, systems, and devices for memory with parallel main and test interfaces. This technology involves configuring a memory die with parallel interfaces that facilitate both evaluation and access operations. A key feature is the presence of two distinct sets of contacts—one for communication between memory dies in multiple-die stacks and another for probing pre-assembly evaluations. This advancement minimizes the risk of damage during the testing process, thereby enhancing the overall capabilities of memory devices.

Another important patent from Nakano focuses on systems and methods for direct bonding in semiconductor die manufacturing. This patent outlines the process of aligning bond pads on two semiconductor substrates and annealing them to create a robust bond. The technique also includes exposing the device to microwave radiation to activate chemical constituents in voids formed during the bonding. These innovations promise improved efficiency in semiconductor manufacturing and device reliability.

Career Highlights

Eiichi Nakano has made significant strides in semiconductor innovation while working at Micron Technology Incorporated. His expertise and inventions have contributed greatly to advancements in memory technologies.

Collaborations

Throughout his career, Nakano has collaborated with notable colleagues, including Owen R. Fay and Mark E. Tuttle. These associations have likely fostered a dynamic work environment conducive to innovation and sharing of technical knowledge.

Conclusion

With a portfolio of 30 patents, Eiichi Nakano stands out as a leading innovator in the semiconductor field. His recent work on memory systems and manufacturing methods highlights his commitment to advancing technology and improving the performance of modern electronic devices. As the industry continues to evolve, Nakano’s contributions are expected to play a crucial role in shaping the future of semiconductor technology.

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