The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2026
Filed:
Jan. 31, 2022
Micron Technology, Inc., Boise, ID (US);
Shiro Uchiyama, Tokyo, JP;
Eiichi Nakano, Boise, ID (US);
Micron Technology, Inc., Boise, ID (US);
Abstract
A semiconductor device assembly including a first semiconductor wafer having a first side and a second side opposite the first side, the first semiconductor wafer including: a first plurality of semiconductor devices at the first side, a plurality of non-metallic vias extending from the second side towards the first side, and a plurality of alignment marks, each vertically aligned with a corresponding one or more of the plurality of non-metallic vias, a second semiconductor wafer including a second plurality of semiconductor devices and a plurality of registration marks, each of the plurality of registration marks vertically aligned with a corresponding one or more of the plurality of alignment marks.