Boon Yew Low

This inventor holds 26 USPTO granted patents and 4 published patent applications, primarily in Semiconductor Packaging. Top assignees: Freescale Semiconductor,inc., Nxp USA, Inc.. Active years: 2011-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Boon Yew Low. Retrieved from https://idiyas.com/inventor/boon-yew-low

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 26 (Patent Applications = 4)

% Patents Active = 80.8

Average Co-Inventor Count = 2.7

ph-index = 4

Forward Citations = 39(Granted Patents)

Location History:

Petaling Jaya, MY (2011 - 2016)
Subang Jaya, MY (2018 - 2023)

Company Filing History:

20 out of 5,491

Freescale Semiconductor,inc.

Years Active: 2011-2025

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Areas of Expertise:

Circuit Modules

Encapsulant

Thermal Dissipation

Integrated Circuit

Copper Pillar Bump

Flexible Substrate

Solar Powered IC

Bond Wire Reinforcement

Mold Cap

Power Rail Pads

Plated Through Holes

Crimping Interconnection

26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12446158 - Circuit modules with encapsulant-embedded leadframe terminals, and methods of fabricating such circuit modules (2025-10-14),

2. 12415305 - Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes (2025-09-16),

3. 11787097 - Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes (2023-10-17),

4. 11581241 - Circuit modules with front-side interposer terminals and through-module thermal dissipation structures (2023-02-14),

5. 11056457 - Semiconductor device with bond wire reinforcement structure (2021-07-06),

6. 9947614 - Packaged semiconductor device having bent leads and method for forming (2018-04-17),

7. 9418929 - Integrated circuit with sewn interconnects (2016-08-16),

8. 9351407 - Method for forming multilayer device having solder filled via connection (2016-05-24),

9. 9299675 - Embedded die ball grid array package (2016-03-29),

10. 9190355 - Multi-use substrate for integrated circuit (2015-11-17),

11. 9165862 - Semiconductor device with plated through holes (2015-10-20),

12. 9159682 - Copper pillar bump and flip chip package using same (2015-10-13),

13. 9034694 - Embedded die ball grid array package (2015-05-19),

14. 9030000 - Mold cap for semiconductor device (2015-05-12),

15. 9000570 - Semiconductor device with corner tie bars (2015-04-07),

Title: Inventor Boon Yew Low - Revolutionizing Technology in Petaling Jaya

Introduction: Boon Yew Low is a visionary inventor based in Petaling Jaya, Malaysia, known for his groundbreaking contributions to the field of technology.

Latest Patents: Boon Yew Low holds several patents in the areas of artificial intelligence, renewable energy, and sustainable technologies, showcasing his commitment to innovation and sustainability.

Career Highlights: With a career spanning over two decades, Boon Yew Low has worked tirelessly to develop cutting-edge solutions that have the potential to shape the future of various industries.

Collaborations: Throughout his career, Boon Yew Low has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life and make a positive impact on society.

Conclusion: Boon Yew Low's passion for innovation and his dedication to creating a sustainable future through technology make him a prominent figure in the world of inventors.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

4 patents pending: