The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2021
Filed:
Sep. 28, 2018
Nxp Usa, Inc., Austin, TX (US);
Boon Yew Low, Subang Jaya, MY;
Lan Chu Tan, Singapore, SG;
Wai Yew Lo, Petaling Jaya, MY;
Poh Leng Eu, Petaling Jaya, MY;
Chin Teck Siong, Sungai Buloh, MY;
NXP USA, INC., Austin, TX (US);
Abstract
A packaged semiconductor device includes a substrate having input/output (I/O) pads, a semiconductor die attached to the substrate and electrically connected to the substrate with bond wires. A bond-wire reinforcement structure is formed over the bond wires before the assembly is covered with a molding compound. The bond-wire reinforcement structure prevents wire sweep during molding and protects the wires from shorting with other wires. In one embodiment, the bond-wire reinforcement structure is formed with a fiberglass and liquid epoxy mixture.