The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 17, 2015
Filed:
Apr. 18, 2014
Weng Hoong Chan, Petaling Jaya, MY;
Ly Hoon Khoo, Bandar Puteri Klang, MY;
Boon Yew Low, Petaling Jaya, MY;
Navas Khan Oratti Kalandar, Petaling Jaya, MY;
Weng Hoong Chan, Petaling Jaya, MY;
Ly Hoon Khoo, Bandar Puteri Klang, MY;
Boon Yew Low, Petaling Jaya, MY;
Navas Khan Oratti Kalandar, Petaling Jaya, MY;
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Abstract
A sub-assembly for a packaged integrated circuit (IC) device has a planar substrate. The substrate's top side has multiple sets electrically connected bond posts arranged in corresponding nested contour zones. Each contour zone includes a different bond post of each bond-post set. The bottom side has a different set of pad connectors electrically connected to the each top-side bond-post set. The sub-assembly can be used for different IC packages having IC dies of different sizes, with different contours of bond posts available for electrical connection depending on the size of the IC die.