Bandar Puteri Klang, Malaysia

Ly Hoon Khoo

USPTO Granted Patents = 7 

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 7(Granted Patents)


Location History:

  • Port Klang, MY (2012)
  • Klang, MY (2015)
  • Bandar, MY (2015)
  • Petaling Jaya, MY (2017)
  • Bandar Puteri Klang, MY (2015 - 2019)

Company Filing History:


Years Active: 2012-2019

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7 patents (USPTO):

Title: The Innovative Contributions of Ly Hoon Khoo

Introduction

Ly Hoon Khoo is a notable inventor based in Bandar Puteri Klang, Malaysia. He has made significant contributions to the field of semiconductor technology, holding a total of 7 patents. His work focuses on enhancing the efficiency and reliability of semiconductor packaging.

Latest Patents

One of his latest patents is for a substrate with a reservoir for die attach adhesive. This innovative substrate design includes a recessed area that prevents die attach adhesive from bleeding into surrounding areas, thereby protecting wire bonds formed on connection sites. The zig-zag pattern of the recessed area allows for sufficient adhesive use without compromising the package size. Another significant patent is the universal BGA substrate, which is designed for assembling ball grid array (BGA) type integrated circuit packages. This substrate features a non-conducting matrix and an array of conducting vias, allowing it to accommodate different BGA package sizes without the need for multiple substrate designs.

Career Highlights

Throughout his career, Ly Hoon Khoo has worked with prominent companies in the semiconductor industry, including Freescale Semiconductor, Inc. and NXP USA, Inc. His experience in these organizations has contributed to his expertise in semiconductor packaging and design.

Collaborations

Ly Hoon Khoo has collaborated with several talented individuals in his field, including Wen Shi Koh and Weng Hoong Chan. These collaborations have fostered innovation and advancements in semiconductor technology.

Conclusion

Ly Hoon Khoo's contributions to semiconductor technology through his patents and collaborations highlight his role as an influential inventor in the industry. His innovative designs continue to impact the efficiency and reliability of semiconductor packaging.

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