The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 08, 2015

Filed:

Oct. 17, 2013
Applicants:

Seng Kiong Teng, Shah Alam, MY;

Ly Hoon Khoo, Bandar Puteri Klang, MY;

Wen Shi Koh, Petaling Jaya, MY;

Inventors:

Seng Kiong Teng, Shah Alam, MY;

Ly Hoon Khoo, Bandar Puteri Klang, MY;

Wen Shi Koh, Petaling Jaya, MY;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/40 (2006.01); H01L 23/495 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49586 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48247 (2013.01);
Abstract

A lead frame includes a lead formed of a conductive material and having first and second ends, opposing first and second main surfaces, and opposing first and second side surfaces each extending between the first and second main surfaces. A polymeric layer is formed at least on the first main surface and the first and second side surfaces of the lead at least proximate the second end of the lead. An opening in the polymeric layer on the first main surface of the lead proximate the second end is provided for connecting the lead to, for example, a semiconductor die via a bond wire.


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