The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 17, 2018
Filed:
Mar. 09, 2016
Applicant:
Freescale Semiconductor, Inc., Austin, TX (US);
Inventors:
Navas Khan Oratti Kalandar, Austin, TX (US);
Nishant Lakhera, Austin, TX (US);
Boon Yew Low, Subang Jaya, MY;
Akhilesh Singh, Austin, TX (US);
Assignee:
NXP USA, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/48 (2006.01); H01L 23/02 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49575 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49513 (2013.01); H01L 23/49548 (2013.01);
Abstract
A package device has a first lead frame having a first flag. A first integrated circuit is on the first flag. A first encapsulant is over the first integrated circuit. A first plurality of leads is electrically bonded to the first integrated circuit. A first lead of the first plurality of leads has an inner portion covered by the first encapsulant and an outer portion extending outside the encapsulant. The outer portion has a hole and a bend at the hole. The outer portion extends above the first encapsulant.