Nishant Lakhera

USPTO Granted Patents = 15 (Patent Applications = 6)

Average Co-Inventor Count = 3.3

ph-index = 1

Forward Citations = 6(Granted Patents)

Company Filing History:

Freescale Semiconductor,inc.

Years Active: 2016-2025

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15 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 12415305 - Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes (2025-09-16),

2. 11908784 - Packaged semiconductor device assembly (2024-02-20),

3. 11787097 - Conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes (2023-10-17),

4. 11270972 - Package with conductive underfill ground plane (2022-03-08),

5. 11189557 - Hybrid package (2021-11-30),

6. 10431534 - Package with support structure (2019-10-01),

7. 10217698 - Die attachment for packaged semiconductor device (2019-02-26),

8. 10211184 - Apparatus and methods for multi-die packaging (2019-02-19),

9. 10147645 - Wafer level chip scale package with encapsulant (2018-12-04),

10. 9978614 - Structure and method to minimize warpage of packaged semiconductor devices (2018-05-22),

11. 9953904 - Electronic component package with heatsink and multiple electronic components (2018-04-24),

12. 9947614 - Packaged semiconductor device having bent leads and method for forming (2018-04-17),

13. 9691637 - Method for packaging an integrated circuit device with stress buffer (2017-06-27),

14. 9559077 - Die attachment for packaged semiconductor device (2017-01-31),

15. 9508632 - Apparatus and methods for stackable packaging (2016-11-29),

Title: Innovations of Inventor Nishant Lakhera

Introduction

Nishant Lakhera is a prominent inventor based in Austin, TX, known for his significant contributions to the field of semiconductor technology. With a total of 15 patents to his name, he has made remarkable advancements in encapsulant compounds and semiconductor device assembly.

Latest Patents

Nishant's latest patents include innovative solutions such as conduit inserts for encapsulant compound formulation kneading and encapsulation back-end assembly processes. This encapsulant compound apparatus features a mechanical operator and an insert designed to capture foreign material in the encapsulant compound. Another notable patent is for a packaged semiconductor device assembly, which comprises a substrate with interconnect pads, a die mounted on the substrate, and a reinforcing interposer. This invention utilizes low-temperature solder material to connect various components, ensuring reliability during the reflow process.

Career Highlights

Throughout his career, Nishant has worked with leading companies in the semiconductor industry, including NXP USA, Inc. and Freescale Semiconductor, Inc. His experience in these organizations has allowed him to develop and refine his innovative ideas, contributing to the advancement of technology in his field.

Collaborations

Nishant has collaborated with talented individuals such as Akhilesh Kumar Singh and Navas Khan Oratti Kalandar, further enhancing his work and expanding his impact in the industry.

Conclusion

Nishant Lakhera's contributions to semiconductor technology through his patents and collaborations highlight his role as a key innovator in the field. His work continues to influence advancements in encapsulant compounds and semiconductor device assembly.

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6 patents pending:

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