The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 26, 2019
Filed:
Dec. 19, 2016
Applicant:
Nxp Usa, Inc., Austin, TX (US);
Inventors:
Akhilesh K. Singh, Austin, TX (US);
Rama I. Hegde, Austin, TX (US);
Nishant Lakhera, Austin, TX (US);
Assignee:
NXP USA, Inc., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49541 (2013.01); H01L 21/4828 (2013.01); H01L 21/561 (2013.01); H01L 21/563 (2013.01); H01L 23/3135 (2013.01); H01L 23/3142 (2013.01); H01L 23/49503 (2013.01); H01L 23/49513 (2013.01); H01L 23/49575 (2013.01); H01L 24/11 (2013.01); H01L 24/13 (2013.01); H01L 24/27 (2013.01); H01L 24/29 (2013.01); H01L 24/30 (2013.01); H01L 24/32 (2013.01); H01L 24/33 (2013.01); H01L 24/49 (2013.01); H01L 24/73 (2013.01); H01L 24/81 (2013.01); H01L 24/83 (2013.01); H01L 24/85 (2013.01); H01L 24/92 (2013.01); H01L 24/96 (2013.01); H01L 24/97 (2013.01); H01L 25/0655 (2013.01); H01L 23/3107 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 2224/119 (2013.01); H01L 2224/1161 (2013.01); H01L 2224/11334 (2013.01); H01L 2224/11436 (2013.01); H01L 2224/131 (2013.01); H01L 2224/133 (2013.01); H01L 2224/13005 (2013.01); H01L 2224/1319 (2013.01); H01L 2224/1329 (2013.01); H01L 2224/13082 (2013.01); H01L 2224/13294 (2013.01); H01L 2224/16245 (2013.01); H01L 2224/2761 (2013.01); H01L 2224/27334 (2013.01); H01L 2224/27436 (2013.01); H01L 2224/291 (2013.01); H01L 2224/293 (2013.01); H01L 2224/2919 (2013.01); H01L 2224/2929 (2013.01); H01L 2224/29294 (2013.01); H01L 2224/30131 (2013.01); H01L 2224/3201 (2013.01); H01L 2224/32014 (2013.01); H01L 2224/32245 (2013.01); H01L 2224/32257 (2013.01); H01L 2224/32258 (2013.01); H01L 2224/3301 (2013.01); H01L 2224/33505 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48106 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/48471 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73257 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/8185 (2013.01); H01L 2224/81192 (2013.01); H01L 2224/81201 (2013.01); H01L 2224/81447 (2013.01); H01L 2224/81455 (2013.01); H01L 2224/81801 (2013.01); H01L 2224/8385 (2013.01); H01L 2224/83104 (2013.01); H01L 2224/83192 (2013.01); H01L 2224/83201 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/83447 (2013.01); H01L 2224/83455 (2013.01); H01L 2224/83801 (2013.01); H01L 2224/83851 (2013.01); H01L 2224/83907 (2013.01); H01L 2224/85205 (2013.01); H01L 2224/85207 (2013.01); H01L 2224/92 (2013.01); H01L 2224/9205 (2013.01); H01L 2224/9222 (2013.01); H01L 2224/92227 (2013.01); H01L 2224/92247 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01026 (2013.01); H01L 2924/01028 (2013.01); H01L 2924/1715 (2013.01); H01L 2924/17747 (2013.01); H01L 2924/181 (2013.01);
Abstract
A method for forming a packaged semiconductor device includes attaching a first major surface of a semiconductor die to a plurality of protrusions extending from a package substrate. A top surface of each protrusion has a die attach material, and the plurality of protrusions define an open region between the first major surface of the semiconductor die and the package substrate. Interconnects are formed between a second major surface of the semiconductor die and the package substrate in which the second major surface opposite the first major surface. An encapsulant material is formed over the semiconductor die and the interconnects.