The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2018

Filed:

Oct. 25, 2016
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Navas Khan Oratti Kalandar, Austin, TX (US);

Akhilesh Kumar Singh, Austin, TX (US);

Nishant Lakhera, Austin, TX (US);

Assignee:

NXP USA, INC., Austin, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/34 (2006.01); H01L 23/36 (2006.01); H01L 23/367 (2006.01); H01L 21/48 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/78 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49568 (2013.01); H01L 21/4825 (2013.01); H01L 21/4882 (2013.01); H01L 21/565 (2013.01); H01L 21/78 (2013.01); H01L 23/3114 (2013.01); H01L 23/4952 (2013.01); H01L 23/49503 (2013.01); H01L 23/49551 (2013.01); H01L 23/49575 (2013.01); H01L 21/4871 (2013.01); H01L 23/34 (2013.01); H01L 23/36 (2013.01); H01L 23/3672 (2013.01); H01L 23/3677 (2013.01);
Abstract

An electronic component package that includes a heat spreader with a die pad. An electronic component is attached to each side of the die pad where each electronic component includes conductive terminals on a side facing away from the die pad. Conductive terminals of the top electronic component are wirebonded to conductive surfaces of a package substrate and conductive terminals of the bottom electronic component are physically and electrically attached to conductive surfaces of the package substrate. The heat spreader structure includes tie structures that extend in a direction away from the second electronic component.


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