The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 29, 2016

Filed:

Jun. 24, 2015
Applicant:

Freescale Semiconductor, Inc., Austin, TX (US);

Inventors:

Navas Khan Oratti Kalandar, Austin, TX (US);

Nishant Lakhera, Austin, TX (US);

Varughese Mathew, Austin, TX (US);

Akhilesh K. Singh, Austin, TX (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/495 (2006.01); H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 29/40 (2006.01); H01L 23/31 (2006.01); H01L 23/00 (2006.01); H01L 21/56 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49548 (2013.01); H01L 21/565 (2013.01); H01L 23/3107 (2013.01); H01L 23/49503 (2013.01); H01L 24/49 (2013.01); H01L 2224/023 (2013.01); H01L 2224/0233 (2013.01); H01L 2224/0235 (2013.01); H01L 2224/08145 (2013.01); H01L 2224/3003 (2013.01); H01L 2224/32145 (2013.01); H01L 2224/3303 (2013.01); H01L 2224/48247 (2013.01); H01L 2225/06503 (2013.01); H01L 2225/06527 (2013.01); H01L 2225/1011 (2013.01); H01L 2225/1041 (2013.01); H01L 2225/1047 (2013.01); H01L 2924/19102 (2013.01); H01L 2925/0655 (2013.01);
Abstract

A semiconductor structure includes a lead frame having a flag and a plurality of leads, a semiconductor die attached to a first major surface of the flag, and a plurality of re-routed lead fingers attached to the lead frame. The plurality of leads has a first pitch. The first end of each re-routed lead finger is attached to a lead of the plurality of leads. Each re-routed lead finger extends over the semiconductor die such that a second end of each re-routed lead finger is over and spaced apart from the flag of the lead frame. The second ends of the plurality of re-routed lead fingers has a second pitch different from the first pitch.


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