The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 29, 2016
Filed:
Apr. 16, 2015
Navas Khan Oratti Kalandar, Austin, TX (US);
Boon Yew Low, Petaling Jaya, MY;
Kesvakumar V. C. Muniandy, Klang, MY;
Navas Khan Oratti Kalandar, Austin, TX (US);
Boon Yew Low, Petaling Jaya, MY;
Kesvakumar V. C. Muniandy, Klang, MY;
FREESCALE SEMICONDUCTOR,INC., Austin, TX (US);
Abstract
A method of assembling a semiconductor package includes attaching a semiconductor die to a frame having a strip or panel form. The semiconductor die has at least one stud bump. The die and the stud bump are covered with a first encapsulation material, and then at least a portion of the stud bump is exposed. At least one die conductive member is formed on the first encapsulation material and electrically coupled to the stud bump. The die conductive member is covered with a second encapsulation material, and then at least a portion of the die conductive member is exposed. At least one grid array conductive member is formed on the second encapsulation material and electrically coupled to the die conductive member. Finally, at least one solder ball is attached to the at least one grid array conductive member.