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For the Inventor, By the Inventor

Klang, Malaysia

Kesvakumar V C Muniandy

USPTO Granted Patents = 10

Average Co-Inventor Count = 2.7

ph-index = 4

Forward Citations = 90(Granted Patents)


Company Filing History:

goldMedal10 out of 5,491 
 
Freescale Semiconductor,inc.
 patents

Years Active: 2014-2016

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10 patents (USPTO):Explore Patents
1. 9299675 - Embedded die ball grid array package (2016-03-29),
2. 9064718 - Pre-formed via array for integrated circuit package (2015-06-23),
3. 9034694 - Embedded die ball grid array package (2015-05-19),
4. 8980696 - Method of packaging semiconductor die (2015-03-17),
5. 8945989 - Stiffened semiconductor die package (2015-02-03),
6. 8853058 - Method of making surface mount stacked semiconductor devices (2014-10-07),
7. 8836098 - Surface mount semiconductor device with solder ball reinforcement frame (2014-09-16),
8. 8810020 - Semiconductor device with redistributed contacts (2014-08-19),
9. 8772913 - Stiffened semiconductor die package (2014-07-08),
10. 8669140 - Method of forming stacked die package using redistributed chip packaging (2014-03-11),

Title: Innovations by Kesvakumar V C Muniandy

Introduction

Kesvakumar V C Muniandy is a notable inventor based in Klang, Malaysia. He has made significant contributions to the field of semiconductor packaging, holding a total of 10 patents. His work focuses on innovative methods for assembling integrated circuit packages, which are crucial for modern electronics.

Latest Patents

Among his latest patents is the "Embedded die ball grid array package." This invention outlines a method of assembling a semiconductor package that involves attaching a semiconductor die to a frame. The die features at least one stud bump, which is covered with a first encapsulation material. The design allows for the formation of die conductive members that are electrically coupled to the stud bump, enhancing the efficiency of the semiconductor package.

Another significant patent is the "Pre-formed via array for integrated circuit package." This method describes the assembly of a 3D integrated circuit package that includes bonding a pre-formed via array to a base device. The process results in a base device with vias that provide electrical connections between the base substrate and a top device, showcasing Muniandy's innovative approach to semiconductor technology.

Career Highlights

Kesvakumar V C Muniandy is currently employed at Freescale Semiconductor, Inc., where he continues to develop cutting-edge technologies in semiconductor packaging. His expertise and innovative mindset have positioned him as a key player in the industry.

Collaborations

Throughout his career, Muniandy has collaborated with talented individuals such as Navas Khan Oratti Kalandar and Lan Chu Tan. These collaborations have further enriched his work and contributed to the advancement of semiconductor technologies.

Conclusion

Kesvakumar V C Muniandy's contributions to the field of semiconductor packaging are noteworthy. His innovative patents and career at Freescale Semiconductor, Inc. highlight his commitment to advancing technology in this critical area.

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