The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 16, 2014

Filed:

May. 15, 2013
Applicants:

Norazham Mohd Sukemi, Subang, MY;

Navas Khan Oratti Kalandar, Petaling Jaya, MY;

Kesvakumar V. C Muniandy, Klang, MY;

Inventors:

Norazham Mohd Sukemi, Subang, MY;

Navas Khan Oratti Kalandar, Petaling Jaya, MY;

Kesvakumar V. C Muniandy, Klang, MY;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/02 (2006.01); H01L 23/48 (2006.01); H01L 23/52 (2006.01); H01L 21/44 (2006.01); H01L 23/00 (2006.01); H01L 23/498 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49816 (2013.01); H01L 24/81 (2013.01);
Abstract

A surface mount semiconductor device having external contact elements exposed in a ball grid array (BGA) at its external active face for mechanical and electrical connection to an external support and a semiconductor die connected electrically internally with the external contact elements. A reinforcement layer of electrically insulating material extends between and surrounds laterally peripheral contact elements of the BGA. The reinforcement layer extends to from about thirty percent (30%) to about fifty percent (50%) of the height of the peripheral contact elements at the active face.


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