The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 19, 2014
Filed:
Jun. 22, 2012
Navas Khan Oratti Kalandar, Subang Jaya, MY;
Chee Seng Foong, Sg Buloh, MY;
Norazham Mohd Sukemi, Subang Jaya, MY;
Kesvakumar V. C. Muniandy, Klang, MY;
Navas Khan Oratti Kalandar, Subang Jaya, MY;
Chee Seng Foong, Sg Buloh, MY;
Norazham Mohd Sukemi, Subang Jaya, MY;
Kesvakumar V. C. Muniandy, Klang, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A semiconductor device has external, exposed electrical contacts at an device active face and a semiconductor die, which has internal, electrical contacts at a die active face. The exposed contacts are offset from the internal contacts laterally of the device active face. A redistribution layer includes a layer of insulating material and redistribution interconnectors within the insulating material, the interconnectors connecting with the exposed contacts. A set of conductors connect the internal contacts and the interconnectors. The conductors have oblong, tear drop shaped cross-sections extending laterally of the die active face beyond the respective internal contacts, and contact the interconnectors at positions spaced further apart than the internal contacts. The redistribution layer may be prefabricated using less costly manufacturing techniques such as lamination.