The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 08, 2014
Filed:
Apr. 04, 2013
Kesvakumar V. C. Muniandy, Klang, MY;
Navas Khan Oratti Kalandar, Subang Jaya, MY;
Kesvakumar V. C. Muniandy, Klang, MY;
Navas Khan Oratti Kalandar, Subang Jaya, MY;
Freescale Semiconductor, Inc., Austin, TX (US);
Abstract
A stiffened semiconductor die package has a semiconductor die including an integrated circuit. The die has an active side with die bonding pads and an opposite inactive side. A conductive frame that acts as a ground plane surrounds all edges of the die and a mold compound covers the conductive frame and the edges of the die. A thermally conductive sheet is attached to the inactive side of the die. A dielectric support structure with external connector pads with solder deposits is attached to the active side of the die. The external connector pads are selectively electrically coupled to the die bonding pads.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile