The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 16, 2016
Filed:
Apr. 22, 2015
Applicants:
Boon Yew Low, Petaling Jaya, MY;
Weng Hoong Chan, Petaling Jaya, MY;
Inventors:
Boon Yew Low, Petaling Jaya, MY;
Weng Hoong Chan, Petaling Jaya, MY;
Assignee:
FREESCALE SEMICONDUCTOR, INC., Austin, TX (US);
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/055 (2006.01); H01L 23/48 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 23/532 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01); H01L 21/768 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49838 (2013.01); H01L 21/76838 (2013.01); H01L 23/3107 (2013.01); H01L 23/53276 (2013.01); H01L 24/17 (2013.01); H01L 24/81 (2013.01); H01L 25/0655 (2013.01); H01L 2221/1094 (2013.01); H01L 2224/16227 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1511 (2013.01);
Abstract
A packaged integrated circuit (IC) device includes a flexible substrate having contact pads, an IC die mounted on the substrate and electrically connected to the contact pads, and conductive threads sewn into the substrate. The conductive threads have proximal ends electrically connected to corresponding ones of the contact pads with conductive bumps. The conductive threads eliminate the need for a complicated multi-layer substrate structure for interconnect fan-out so the substrate may be formed of a variety of materials such as cloth or paper.