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Bernard Aspar

USPTO Granted Patents = 75 (Patent Applications = 4)

CIPO Patents = 1

EPO Patents = 26 (Patent Applications = 9)

Average Co-Inventor Count = 2.8

ph-index = 23

Forward Citations = 2,950(Granted Patents)

Forward Citations (Not Self Cited) = 2,756(Dec 10, 2025)

Inventors with similar research interests:

Location History:

St Ismier, FR (2012)
St. Ismier, FR (2012 - 2013)
Rives, FR (2000 - 2014)
Saint Ismier, FR (2013 - 2023)

Company Filing History:

47 out of 3,559

Commissariat a L'energie Atomique

S.o.i.tec Silicon on Insulator Technologies

S.o.i. Tec Silicon on Insulator Technologies, S.a.

Commissariat À L'energie Atomique (cea)

Tracit Technologies

7. 2 out of 4,872

Commissariat À L'Énergie Atomique Et Aux Énergies Alternatives

Commissariat a L'atomique

S.o.i. Tec Silicon on Insulator Technologies of Chemin Des Franques

10. 1 out of 45

E2v Semiconductors

where one patent can have more than one assignee

Years Active: 2000-2025

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Areas of Expertise:

Radio Frequency Applications

Heterostructure Fabrication

Semiconductor Structures

MEMS Devices

Thin Film Transfer

Wafer Bonding

Microstructure Fabrication

Surface Roughening

Stacked Structures

SOI Structures

Crystal Orientation Control

Defect Treatment

75 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12418120 - Structure for radio frequency applications (2025-09-16),

2. 12101080 - Heterostructure and method of fabrication (2024-09-24),

3. 11637542 - Heterostructure and method of fabrication (2023-04-25),

4. 11595020 - Heterostructure and method of fabrication (2023-02-28),

5. 11502428 - Structure for radio frequency applications (2022-11-15),

6. 11043756 - Structure for radio frequency applications (2021-06-22),

7. 10826459 - Heterostructure and method of fabrication (2020-11-03),

8. 9728458 - Methods for fabrication of semiconductor structures using laser lift-off process, and related semiconductor structures (2017-08-08),

9. 9511996 - Methods of forming semiconductor structures including MEMS devices and integrated circuits on common sides of substrates, and related structures and devices (2016-12-06),

10. 9481566 - Methods of forming semiconductor structures including MEMS devices and integrated circuits on opposing sides of substrates, and related structures and devices (2016-11-01),

11. 8722515 - Process of treating defects during the bonding of wafers (2014-05-13),

12. 8679946 - Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate (2014-03-25),

13. 8628674 - Method for trimming a structure obtained by the assembly of two plates (2014-01-14),

14. 8609514 - Process for the transfer of a thin film comprising an inclusion creation step (2013-12-17),

15. 8575010 - Method for fabricating a semiconductor substrate (2013-11-05),

Title: Bernard Aspar - Innovative Inventor from Rives, FR

Introduction: Bernard Aspar is a renowned inventor hailing from Rives, France, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Bernard Aspar holds several patents in various technological domains, showcasing his continuous dedication to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Bernard Aspar has consistently demonstrated his prowess in developing cutting-edge solutions that have revolutionized the industry.

Collaborations: Throughout his career, Bernard Aspar has collaborated with leading tech companies and research institutions, fostering a culture of innovation and knowledge-sharing.

Conclusion: Bernard Aspar's relentless passion for innovation and his remarkable contributions have solidified his position as a trailblazer in the world of inventors and innovators.

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