Bernard Aspar

This inventor holds 76 USPTO granted patents and 3 published patent applications, plus 1 CIPO patent and 26 EPO patents, primarily in Semiconductor Fabrication (CPC class H01L). Top assignees: Commissariat a L'energie Atomique Et Aux Energies Alternatives, Soitec, S.o.i.tec Silicon on Insulator Technologies. Active years: 2000-2026.

USPTO Granted Patents = 76 (Patent Applications = 3)

% Patents Active = 80.3

CIPO Patents = 1

EPO Patents = 26 (Patent Applications = 8)

Average Co-Inventor Count = 2.9

ph-index = 23

Forward Citations = 2,965(Granted Patents)

Forward Citations (Not Self Cited) = 2,756(Dec 10, 2025)

Inventors with similar research interests:

Location History:

St Ismier, FR (2012)
St. Ismier, FR (2012 - 2013)
Rives, FR (2000 - 2014)
Saint Ismier, FR (2013 - 2023)

Company Filing History:

51 out of 8,816

Commissariat a L'energie Atomique Et Aux Energies Alternatives

S.o.i.tec Silicon on Insulator Technologies

patents

4. 2 out of 86

S.o.i. Tec Silicon on Insulator Technologies, S.a.

Commissariat a L'atomique

S.o.i. Tec Silicon on Insulator Technologies of Chemin Des Franques

patent

where one patent can have more than one assignee

Years Active: 2000-2026

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Areas of Expertise:

Radio Frequency Applications

Heterostructure

Semiconductor Structures

Laser Lift-Off Process

MEMS Devices

Integrated Circuits

Thin Film Transfer

Wafer Bonding

Stacked Structures

Surface Roughening

Partial SOI Structures

Detachable Substrate

76 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12744508 - Heterostructure and method of fabrication (2026-09-22),

2. 12418120 - Structure for radio frequency applications (2025-09-16),

3. 12101080 - Heterostructure and method of fabrication (2024-09-24),

4. 11637542 - Heterostructure and method of fabrication (2023-04-25),

5. 11595020 - Heterostructure and method of fabrication (2023-02-28),

6. 11502428 - Structure for radio frequency applications (2022-11-15),

7. 11043756 - Structure for radio frequency applications (2021-06-22),

8. 10826459 - Heterostructure and method of fabrication (2020-11-03),

9. 9728458 - Methods for fabrication of semiconductor structures using laser lift-off process, and related semiconductor structures (2017-08-08),

10. 9511996 - Methods of forming semiconductor structures including MEMS devices and integrated circuits on common sides of substrates, and related structures and devices (2016-12-06),

11. 9481566 - Methods of forming semiconductor structures including MEMS devices and integrated circuits on opposing sides of substrates, and related structures and devices (2016-11-01),

12. 8722515 - Process of treating defects during the bonding of wafers (2014-05-13),

13. 8679946 - Manufacturing process for a stacked structure comprising a thin layer bonding to a target substrate (2014-03-25),

14. 8628674 - Method for trimming a structure obtained by the assembly of two plates (2014-01-14),

15. 8609514 - Process for the transfer of a thin film comprising an inclusion creation step (2013-12-17),

Title: Bernard Aspar - Innovative Inventor from Rives, FR

Introduction: Bernard Aspar is a renowned inventor hailing from Rives, France, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Bernard Aspar holds several patents in various technological domains, showcasing his continuous dedication to pushing the boundaries of innovation.

Career Highlights: With a career spanning over two decades, Bernard Aspar has consistently demonstrated his prowess in developing cutting-edge solutions that have revolutionized the industry.

Collaborations: Throughout his career, Bernard Aspar has collaborated with leading tech companies and research institutions, fostering a culture of innovation and knowledge-sharing.

Conclusion: Bernard Aspar's relentless passion for innovation and his remarkable contributions have solidified his position as a trailblazer in the world of inventors and innovators.