logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 12744508 B1

PDFFull Text
Date of Patent:
Sep. 22, 2026

Filed:

Jul. 31, 2024

Heterostructure and method of fabrication

Applicant:

Soitec, Bernin, FR;

Inventors:

Arnaud Castex, Grenoble, FR;

Daniel Delprat, Crolles, FR;

Bernard Aspar, Saint-Ismier, FR;

Ionut Radu, Crolles, FR;

Assignee:

Soitec, Bernin, FR;

Attorney:

TraskBritt

Primary Examiner:

Jorge L Salazar, Jr

Int. Cl.
CPC ...
H03H 9/02 (2006.01); H03H 3/04 (2006.01); H03H 3/10 (2006.01); H03H 9/64 (2006.01); H10N 30/00 (2023.01); H10N 30/072 (2023.01); H10N 30/073 (2023.01); H10N 30/082 (2023.01); H10N 30/086 (2023.01); H10N 30/853 (2023.01); H10N 35/01 (2023.01);
U.S. Cl.
CPC ...
H03H 9/02834 (2013.01); H03H 3/04 (2013.01); H03H 3/10 (2013.01); H03H 9/02574 (2013.01); H10N 30/072 (2023.02); H10N 30/073 (2023.02); H10N 30/704 (2024.05); H10N 30/8542 (2023.02); H03H 9/6496 (2013.01); H10N 30/082 (2023.02); H10N 30/086 (2023.02); H10N 35/01 (2023.02); Y10T 29/42 (2015.01);
Abstract

The present invention relates to a heterostructure, in particular, a piezoelectric structure, comprising a cover layer, in particular, a layer of piezoelectric material, the material of the cover layer having a first coefficient of thermal expansion, assembled to a support substrate, the support substrate having a second coefficient of thermal expansion substantially different from the first coefficient of thermal expansion, at an interface wherein the cover layer comprises at least a recess extending from the interface into the cover layer, and its method of fabrication.

Find Patent Forward Citations

Castex, Arnaud. (2026). Heterostructure and method of fabrication (U.S. Patent No. 12744508). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12744508

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Loading…