Daniel Delprat

This inventor holds 26 USPTO granted patents and 2 published patent applications and 8 EPO patents. Top assignees: Soitec, Corning Incorporated, S.o.i.tec Silicon on Insulator Technologies. Active years: 2002-2026.

USPTO Granted Patents = 26 (Patent Applications = 2)

% Patents Active = 84.6

EPO Patents = 8 (Patent Applications = 7)

Average Co-Inventor Count = 3.5

ph-index = 5

Forward Citations = 78(Granted Patents)

Location History:

Vulaines/Seine, FR (2002)
Vulanies/Seine, FR (2003)
Crolles, FR (2008 - 2023)

Company Filing History:

S.o.i.tec Silicon on Insulator Technologies

patents

where one patent can have more than one assignee

Years Active: 2002-2026

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26 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12744508 - Heterostructure and method of fabrication (2026-09-22),

2. 12525483 - Method for transferring a thin layer onto a support substrate provided with a charge-trapping layer (2026-01-13),

3. 12362226 - Method for forming a handling substrate for a composite structure intended for RF applications and handling substrate (2025-07-15),

4. 12101080 - Heterostructure and method of fabrication (2024-09-24),

5. 11637542 - Heterostructure and method of fabrication (2023-04-25),

6. 11595020 - Heterostructure and method of fabrication (2023-02-28),

7. 11373898 - Method for manufacturing a semiconductor on insulator type structure by layer transfer (2022-06-28),

8. 11205702 - Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit (2021-12-21),

9. 10826459 - Heterostructure and method of fabrication (2020-11-03),

10. 9716029 - Method for transferring a layer of a semiconductor and substrate comprising a confinement structure (2017-07-25),

11. 9293473 - Method for manufacturing a semiconductor on insulator structure having low electrical losses (2016-03-22),

12. 8962450 - Method for manufacturing a semiconductor-on-insulator structure having low electrical losses (2015-02-24),

13. 8946053 - Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate (2015-02-03),

14. 8790993 - Method for molecular bonding of silicon and glass substrates (2014-07-29),

15. 8772875 - Semiconductor on glass substrate with stiffening layer (2014-07-08),

Title: Daniel Delprat - Innovative Inventor from Crolles, FR

Introduction: Daniel Delprat is a renowned inventor hailing from Crolles, France, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Daniel Delprat holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Daniel Delprat has worked with leading tech companies, research institutions, and universities, playing a pivotal role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Daniel Delprat has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge sharing to drive forward progress in the field of technology.

Conclusion: Daniel Delprat's passion for innovation, coupled with his relentless pursuit of excellence, has solidified his reputation as a visionary inventor whose work continues to inspire and shape the future of technology.