IDiyas

For the Inventor, By the Inventor

Crolles, France

Daniel Delprat

USPTO Granted Patents = 24 

 

Average Co-Inventor Count = 3.5

ph-index = 5

Forward Citations = 78(Granted Patents)


Location History:

  • Vulaines/Seine, FR (2002)
  • Vulanies/Seine, FR (2003)
  • Crolles, FR (2008 - 2023)

Company Filing History:

goldMedal17 out of 507 
 
Soitec
 patents
silverMedal5 out of 7,268 
 
Corning Incorporated
 patents
bronzeMedal5 out of 214 
 
S.o.i.tec Silicon on Insulator Technologies
 patents
where one patent can have more than one assignee

Years Active: 2002-2025

Loading Chart...
Loading Chart...
24 patents (USPTO):
1. 12362226 - Method for forming a handling substrate for a composite structure intended for RF applications and handling substrate (2025-07-15),
2. 12101080 - Heterostructure and method of fabrication (2024-09-24),
3. 11637542 - Heterostructure and method of fabrication (2023-04-25),
4. 11595020 - Heterostructure and method of fabrication (2023-02-28),
5. 11373898 - Method for manufacturing a semiconductor on insulator type structure by layer transfer (2022-06-28),
6. 11205702 - Method for manufacturing a structure for forming a tridimensional monolithic integrated circuit (2021-12-21),
7. 10826459 - Heterostructure and method of fabrication (2020-11-03),
8. 9716029 - Method for transferring a layer of a semiconductor and substrate comprising a confinement structure (2017-07-25),
9. 9293473 - Method for manufacturing a semiconductor on insulator structure having low electrical losses (2016-03-22),
10. 8962450 - Method for manufacturing a semiconductor-on-insulator structure having low electrical losses (2015-02-24),
11. 8946053 - Method for reducing irregularities at the surface of a layer transferred from a source substrate to a glass-based support substrate (2015-02-03),
12. 8790993 - Method for molecular bonding of silicon and glass substrates (2014-07-29),
13. 8772875 - Semiconductor on glass substrate with stiffening layer (2014-07-08),
14. 8658514 - Method for manufacturing a semiconductor-on-insulator structure having low electrical losses, and corresponding structure (2014-02-25),
15. 8580654 - Method for molecular bonding of silicon and glass substrates (2013-11-12),

Title: Daniel Delprat - Innovative Inventor from Crolles, FR

Introduction: Daniel Delprat is a renowned inventor hailing from Crolles, France, known for his groundbreaking contributions to the field of technology and innovation.

Latest Patents: Daniel Delprat holds several patents in the areas of semiconductor technology, renewable energy, and artificial intelligence, showcasing his diverse range of expertise and innovative thinking.

Career Highlights: With a career spanning over two decades, Daniel Delprat has worked with leading tech companies, research institutions, and universities, playing a pivotal role in developing cutting-edge technologies that have revolutionized various industries.

Collaborations: Throughout his career, Daniel Delprat has collaborated with top engineers, scientists, and researchers from around the world, fostering a culture of innovation and knowledge sharing to drive forward progress in the field of technology.

Conclusion: Daniel Delprat's passion for innovation, coupled with his relentless pursuit of excellence, has solidified his reputation as a visionary inventor whose work continues to inspire and shape the future of technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…