The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 03, 2015
Filed:
Jun. 20, 2011
Applicants:
Daniel Delprat, Crolles, FR;
Carine Duret, Grenoble, FR;
Nadia Ben-mohamed, Renage, FR;
Fabrice Lallement, Grenoble, FR;
Inventors:
Daniel Delprat, Crolles, FR;
Carine Duret, Grenoble, FR;
Nadia Ben-Mohamed, Renage, FR;
Fabrice Lallement, Grenoble, FR;
Assignee:
Soitec, Bernin, FR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 29/02 (2006.01); H01L 21/762 (2006.01); H01L 21/18 (2006.01);
U.S. Cl.
CPC ...
H01L 29/02 (2013.01); H01L 21/76254 (2013.01); H01L 21/185 (2013.01); H01L 21/762 (2013.01);
Abstract
A method for reducing irregularities at a surface of a layer transferred from a source substrate to a glass-based support substrate, by generating a weakening zone in the source substrate; contacting the source substrate and the glass-based support substrate; and splitting the source substrate at the weakening zone; wherein the glass-based substrate has a thickness of between 300 μm and 600 μm.