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For the Inventor, By the Inventor

Yamhill, OR, United States of America

Andy Chih-Hung Wei

This inventor holds 28 USPTO granted patents and 24 published patent applications and 7 EPO patents, primarily in Integrated Circuit Design. Top assignees: Intel Corporation, Intel Ndtm US LLC. Active years: 2022-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Andy Chih-Hung Wei. Retrieved from https://idiyas.com/inventor/andy-chih-hung-wei-ra5qn4f7

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 28 

% Patents Active = 100.0

 

Average Co-Inventor Count = 2.6

ph-index = 1

Forward Citations = 3(Granted Patents)


Company Filing History:

goldMedal27 out of 56,365 
 
Intel Corporation
 patents
silverMedal1 out of 52 
 
Intel Ndtm US LLC
 patents

Years Active: 2022-2026

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Areas of Expertise:
Integrated Circuit
Transistor Structures
Self-Aligned Contacts
Gate Architectures
Power Rails
Channel Sizing
Stacked Vias
Isolation Regions
Device Contacts
Nanoribbon Semiconductors
Electrostatic Discharge
Trench Contacts
28 patents (USPTO):Explore Patents
1. 12721180 - Techniques for protecting integrated circuitry from plasma-induced electrostatic discharge using a carrier substrate with junction features (2026-08-25),
2. 12690257 - Stacked source or drain contact flyover (2026-07-21),
3. 12684824 - Integrated circuits with self-aligned tub architecture (2026-07-14),
4. 12512407 - Stitching to enable dense interconnect arrangements (2025-12-30),
5. 12506076 - Power rail between fins of a transistor structure (2025-12-23),
6. 12489057 - Gate tie structures to buried or backside power rails (2025-12-02),
7. 12471330 - Integrated circuit structures having maximized channel sizing (2025-11-11),
8. 12439659 - Gate-all-around integrated circuit structures having germanium-diffused nanoribbon channel structures (2025-10-07),
9. 12426307 - Dual metal gate structures on nanoribbon semiconductor devices (2025-09-23),
10. 12376353 - Source/drain regions in integrated circuit structures (2025-07-29),
11. 12328936 - Gate spacing in integrated circuit structures (2025-06-10),
12. 12327791 - Integrated circuit structures with gate cuts above buried power rails (2025-06-10),
13. 12315805 - Self-aligned lateral contacts (2025-05-27),
14. 12237388 - Transistor arrangements with stacked trench contacts and gate straps (2025-02-25),
15. 12211898 - Device contact sizing in integrated circuit structures (2025-01-28),

Title: Andy Chih-Hung Wei: Pioneering Inventor from Yamhill

Introduction: Andy Chih-Hung Wei is a distinguished inventor hailing from Yamhill, Oregon. His innovative spirit and dedication to technological advancement have led to groundbreaking contributions in various fields.

Latest Patents: Andy Chih-Hung Wei holds several patents in the areas of renewable energy technologies, sustainable agriculture practices, and advanced medical devices. His recent patents showcase his commitment to creating solutions for pressing global challenges.

Career Highlights: With a background in engineering and a passion for problem-solving, Andy Chih-Hung Wei has had a successful career marked by numerous achievements. He has worked with leading research institutions and companies to bring his inventions to life.

Collaborations: Throughout his career, Andy Chih-Hung Wei has collaborated with fellow inventors, scientists, and industry experts to further develop and refine his ideas. His collaborative efforts have resulted in the successful implementation of several cutting-edge technologies.

Conclusion: Andy Chih-Hung Wei's relentless pursuit of innovation and his remarkable contributions to various fields make him a true pioneer in the world of inventors. His work continues to inspire and drive progress in the ever-evolving landscape of technology and science.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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