The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 25, 2025

Filed:

Dec. 16, 2020
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Andy Chih-Hung Wei, Yamhill, OR (US);

Changyok Park, Portland, OR (US);

Guillaume Bouche, Portland, OR (US);

Hyuk Ju Ryu, Portland, OR (US);

Charles Henry Wallace, Portland, OR (US);

Mohit K. Haran, Hillsboro, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 29/423 (2006.01); H01L 21/768 (2006.01); H01L 25/065 (2023.01); H01L 27/088 (2006.01); H01L 29/10 (2006.01); H01L 29/78 (2006.01);
U.S. Cl.
CPC ...
H01L 29/4236 (2013.01); H01L 29/1033 (2013.01); H01L 29/1095 (2013.01); H01L 29/7855 (2013.01);
Abstract

Disclosed herein are transistor arrangements with trench contacts that have two parts—a first trench contact and a second trench contact—stacked over one another. Such transistor arrangements may be fabricated by forming a first trench contact over a source or drain contact of a transistor, recessing the first trench contact, forming the second trench contact over the first trench contact, and, finally, forming a gate contact that is electrically isolated from, while being self-aligned to, the second trench contact. Such a fabrication process may provide improvements in terms of increased edge placement error margin, cost-efficiency, and device performance, compared to conventional approaches to forming trench and gate contacts. The conductive material of the first trench contact may also be deposited over the gate electrodes of transistors, forming a gate strap, to advantageously reduce gate resistance.


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