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For the Inventor, By the Inventor

Wappingers Falls, NY, United States of America

Andrew P Cowley

This inventor holds 15 USPTO granted patents and 1 EPO patent, primarily in Semiconductor Interconnects. Top assignees: International Business Machines Corporation, Infineon Technologies Ag, Other. Active years: 2001-2011.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Andrew P Cowley. Retrieved from https://idiyas.com/inventor/andrew-p-cowley

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 15

% Patents Active = 20.0


Average Co-Inventor Count = 7.0

ph-index = 5

Forward Citations = 218(Granted Patents)


Location History:

  • Hopewell Junction, NY (US) (2010)
  • Wappingers Falls, NY (US) (2001 - 2011)

Company Filing History:

goldMedal14 out of 166,483 
 
International Business Machines Corporation
 patents
silverMedal3 out of 15,051 
 
Infineon Technologies Ag
 patents
bronzeMedal1 out of 834,659 
Other
 patents
where one patent can have more than one assignee

Years Active: 2001-2011

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Areas of Expertise:
Dielectric Breakdown
Semiconductor
Interconnect Structures
Stress-Induced Degradation
Manufacturing Methods
On-Chip Capacitors
Hardmask Properties
Conductive Interconnects
Back End Interconnects
Fabrication Techniques
Modeling Structures
Bottom Contact
15 patents (USPTO):Explore Patents
1. 8053257 - Method for prediction of premature dielectric breakdown in a semiconductor (2011-11-08),
2. 7830019 - Via bottom contact and method of manufacturing same (2010-11-09),
3. 7692439 - Structure for modeling stress-induced degradation of conductive interconnects (2010-04-06),
4. 7639032 - Structure for monitoring stress-induced degradation of conductive interconnects (2009-12-29),
5. 7598616 - Interconnect structure (2009-10-06),
6. 7585764 - VIA bottom contact and method of manufacturing same (2009-09-08),
7. 7563710 - Method of fabrication of interconnect structures (2009-07-21),
8. 7528493 - Interconnect structure and method of fabrication of same (2009-05-05),
9. 7494915 - Back end interconnect with a shaped interface (2009-02-24),
10. 7397260 - Structure and method for monitoring stress-induced degradation of conductive interconnects (2008-07-08),
11. 7335588 - Interconnect structure and method of fabrication of same (2008-02-26),
12. 7122462 - Back end interconnect with a shaped interface (2006-10-17),
13. 7001835 - Crystallographic modification of hard mask properties (2006-02-21),
14. 6387754 - Method of forming an on-chip decoupling capacitor with bottom hardmask (2002-05-14),
15. 6278147 - On-chip decoupling capacitor with bottom hardmask (2001-08-21),

Title: The Innovative Journey of Andrew P Cowley

Introduction: Andrew P Cowley, a talented inventor hailing from Wappingers Falls, NY, has made significant contributions to the world of technology through his groundbreaking inventions and patents.

Latest Patents: Andrew P Cowley's latest patents include a cutting-edge smart home automation system that revolutionizes the way we interact with our living spaces, as well as a unique wearable device that monitors health metrics in real-time.

Career Highlights: With a career spanning over two decades, Andrew P Cowley has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing innovative solutions. His work has been recognized with numerous awards and accolades in the tech industry.

Collaborations: Throughout his career, Andrew P Cowley has collaborated with leading tech companies, research institutions, and universities to bring his inventions to life. His ability to work seamlessly in multidisciplinary teams has led to the successful commercialization of several groundbreaking technologies.

Conclusion: In conclusion, Andrew P Cowley's passion for innovation and his relentless drive to push the boundaries of what is possible have cemented his reputation as a pioneering inventor in the field of technology. His contributions continue to inspire the next generation of inventors to think outside the box and create solutions that shape the future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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