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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7598616 B1

PDFFull Text
Expired
Date of Patent:
Oct. 06, 2009

Filed:

Jun. 17, 2008

Interconnect structure

Applicants:

Chih-chao Yang, Poughkeepsie, NY (US);

Lawrence A. Clevenger, La Grangeville, NY (US);

Andrew P. Cowley, Wappingers Falls, NY (US);

Timothy J. Dalton, Ridgefield, CT (US);

Meeyoung H. Yoon, Hopewell Junction, NY (US);

Inventors:

Chih-Chao Yang, Poughkeepsie, NY (US);

Lawrence A. Clevenger, La Grangeville, NY (US);

Andrew P. Cowley, Wappingers Falls, NY (US);

Timothy J. Dalton, Ridgefield, CT (US);

Meeyoung H. Yoon, Hopewell Junction, NY (US);

Assignee:

International Business Machines Corporation, Armonk, NY (US);

Attorneys:

Schmeiser, Olsen & Watts

Robert M. Trepp

Primary Examiner:

Long K Tran

Int. Cl.
CPC ...
H01L 29/06 (2006.01); H01L 21/4763 (2006.01);
U.S. Cl.
CPC ...
Abstract

A structure. The structure includes: a core electrical conductor having a top surface, an opposite bottom surface and sides between the top and bottom surfaces; an electrically conductive liner in direct physical contact with and covering the bottom surface and the sides of the core electrical conductor, embedded portions of the electrically conductive liner in direct physical contact with and extending over the core electrical conductor in regions of the core electrical conductor adjacent to both the top surface and the sides of the core electrical conductor; and an electrically conductive cap in direct physical contact with the top surface of the core electrical conductor that is exposed between the embedded portions of the electrically conductive liner.

Find Patent Forward Citations

Yang, Chih-Chao. (2009). Interconnect structure (U.S. Patent No. 7598616). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7598616

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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