The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 24, 2009
Filed:
Aug. 09, 2006
Lawrence A. Clevenger, LaGrangeville, NY (US);
Andrew P. Cowley, Wappingers Falls, NY (US);
Timothy J. Dalton, Ridgefield, CT (US);
Mark Hoinkis, Fishkill, NY (US);
Steffen K. Kaldor, Fishkill, NY (US);
Erdem Kaltalioglu, Fishkill, NY (US);
Kaushik A. Kumar, Beacon, NY (US);
Douglas C. LA Tulipe, Jr., Danbury, CT (US);
Jochen Schacht, Hsinchu, TW;
Andrew H. Simon, Fishkill, NY (US);
Terry A. Spooner, New Fairfield, CT (US);
Yun-yu Wang, Poughquag, NY (US);
Clement H. Wann, Carmel, NY (US);
Chih-chao Yang, Beacon, NY (US);
Lawrence A. Clevenger, LaGrangeville, NY (US);
Andrew P. Cowley, Wappingers Falls, NY (US);
Timothy J. Dalton, Ridgefield, CT (US);
Mark Hoinkis, Fishkill, NY (US);
Steffen K. Kaldor, Fishkill, NY (US);
Erdem Kaltalioglu, Fishkill, NY (US);
Kaushik A. Kumar, Beacon, NY (US);
Douglas C. La Tulipe, Jr., Danbury, CT (US);
Jochen Schacht, Hsinchu, TW;
Andrew H. Simon, Fishkill, NY (US);
Terry A. Spooner, New Fairfield, CT (US);
Yun-Yu Wang, Poughquag, NY (US);
Clement H. Wann, Carmel, NY (US);
Chih-Chao Yang, Beacon, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Infineon Technologies, AG, Munich, DE;
Abstract
An interconnect structure in the back end of the line of an integrated circuit forms contacts between successive layers by removing material in the top surface of the lower interconnect in a cone-shaped aperture, the removal process extending through the liner of the upper aperture, and depositing a second liner extending down into the cone-shaped aperture, thereby increasing the mechanical strength of the contact, which then enhance the overall reliability of the integrated circuit.