The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 06, 2010
Filed:
May. 22, 2008
Kaushik Chanda, Fishkill, NY (US);
Birendra Agarwala, Hopewell Junction, NY (US);
Lawrence A. Clevenger, La Grangeville, NY (US);
Andrew P. Cowley, Wappingers Falls, NY (US);
Ronald G. Filippi, Wappingers Falls, NY (US);
Jason P. Gill, Essex Junction, VT (US);
Tom C. Lee, Essex Junction, VT (US);
Baozhen LI, South Burlington, VT (US);
Paul S. Mclaughlin, Poughkeepsie, NY (US);
Du B. Nguyen, Danbury, CT (US);
Hazara S. Rathore, Stormville, NY (US);
Timothy D. Sullivan, Underhill, VT (US);
Chih-chao Yang, Poughkeepsie, NY (US);
Kaushik Chanda, Fishkill, NY (US);
Birendra Agarwala, Hopewell Junction, NY (US);
Lawrence A. Clevenger, La Grangeville, NY (US);
Andrew P. Cowley, Wappingers Falls, NY (US);
Ronald G. Filippi, Wappingers Falls, NY (US);
Jason P. Gill, Essex Junction, VT (US);
Tom C. Lee, Essex Junction, VT (US);
Baozhen Li, South Burlington, VT (US);
Paul S. McLaughlin, Poughkeepsie, NY (US);
Du B. Nguyen, Danbury, CT (US);
Hazara S. Rathore, Stormville, NY (US);
Timothy D. Sullivan, Underhill, VT (US);
Chih-Chao Yang, Poughkeepsie, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A structure representative of a conductive interconnect of a microelectronic element is provided, which may include a conductive metallic plate having an upper surface, a lower surface, and a plurality of peripheral edges extending between the upper and lower surfaces, the upper surface defining a horizontally extending plane. The structure may also include a lower via having a top end in conductive communication with the metallic plate and a bottom end vertically displaced from the top end. A lower conductive or semiconductive element can be in contact with the bottom end of the lower via. An upper metallic via can lie in at least substantial vertical alignment with the lower conductive via, the upper metallic via having a bottom end in conductive communication with the metallic plate and a top end vertically displaced from the bottom end. The upper metallic via may have a width at least about ten times than the length of the metallic plate and about ten times smaller than the width of the metallic plate. The structure may further include an upper metallic line element in contact with the top end of the upper metallic via.