IDiyas

For the Inventor, By the Inventor

Danbury, CT, United States of America

Du Binh Nguyen

USPTO Granted Patents = 22 

Average Co-Inventor Count = 4.6

ph-index = 13

Forward Citations = 1,147(Granted Patents)


Location History:

  • Fairfield County, CT (US) (2000)
  • Danbury, CT (US) (1993 - 2013)

Company Filing History:

goldMedal22 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1993-2013

where 'Filed Patents' based on already Granted Patents

22 patents (USPTO):
1. 8466056 - Method of forming metal interconnect structures in ultra low-k dielectrics (2013-06-18),
2. 7692439 - Structure for modeling stress-induced degradation of conductive interconnects (2010-04-06),
3. 7639032 - Structure for monitoring stress-induced degradation of conductive interconnects (2009-12-29),
4. 7397260 - Structure and method for monitoring stress-induced degradation of conductive interconnects (2008-07-08),
5. 7279411 - Process for forming a redundant structure (2007-10-09),
6. 7163883 - Edge seal for a semiconductor device (2007-01-16),
7. 7138714 - Via barrier layers continuous with metal line barrier layers at notched or dielectric mesa portions in metal lines (2006-11-21),
8. 6972209 - Stacked via-stud with improved reliability in copper metallurgy (2005-12-06),
9. 6825561 - Structure and method for eliminating time dependent dielectric breakdown failure of low-k material (2004-11-30),
10. 6734090 - Method of making an edge seal for a semiconductor device (2004-05-11),
11. 6348731 - Copper interconnections with enhanced electromigration resistance and reduced defect sensitivity and method of forming same (2002-02-19),
12. 6294835 - Self-aligned composite insulator with sub-half-micron multilevel high density electrical interconnections and process thereof (2001-09-25),
13. 6287954 - Method of forming copper interconnections with enhanced electromigration resistance and reduced defect sensitivity (2001-09-11),
14. 6258710 - Sub-quarter-micron copper interconnections with improved electromigration resistance and reduced defect sensitivity (2001-07-10),
15. 6133139 - Self-aligned composite insulator with sub-half-micron multilevel high (2000-10-17),

Title: The Innovative Journey of Du Binh Nguyen

Introduction: Du Binh Nguyen, a talented inventor hailing from Danbury, CT, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Du Binh Nguyen's latest patents include a cutting-edge smart home device that revolutionizes the way we interact with our living spaces, and a sustainable energy solution that aims to combat climate change.

Career Highlights: With a career spanning over two decades, Du Binh Nguyen has established himself as a visionary in the field of technology. His work has been recognized with numerous awards and accolades, solidifying his reputation as a pioneer in the industry.

Collaborations: Throughout his career, Du Binh Nguyen has collaborated with leading tech companies and research institutions to bring his ideas to life. His ability to work seamlessly with teams of experts has led to the successful development of innovative products that have had a lasting impact on society.

Conclusion: Du Binh Nguyen's passion for innovation and his relentless drive to push the boundaries of what is possible have cemented his legacy as a true trailblazer in the world of technology. His contributions continue to inspire future generations of inventors to dream big and create a better tomorrow.

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