IDiyas

For the Inventor, By the Inventor

Hopewell Junction, NY, United States of America

Birendra N Agarwala

USPTO Granted Patents = 21 

Average Co-Inventor Count = 3.8

ph-index = 14

Forward Citations = 1,310(Granted Patents)


Location History:

  • Wappingers Falls, NY (US) (1990 - 1991)
  • Hopewell Junction, NY (US) (1992 - 2010)
  • Hopewell Junctions, NY (US) (2013)

Company Filing History:

goldMedal21 out of 164,108 
 
International Business Machines Corporation
 patents

Years Active: 1990-2013

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21 patents (USPTO):
1. 8466056 - Method of forming metal interconnect structures in ultra low-k dielectrics (2013-06-18),
2. 7692439 - Structure for modeling stress-induced degradation of conductive interconnects (2010-04-06),
3. 7639032 - Structure for monitoring stress-induced degradation of conductive interconnects (2009-12-29),
4. 7470613 - Dual damascene multi-level metallization (2008-12-30),
5. 7397260 - Structure and method for monitoring stress-induced degradation of conductive interconnects (2008-07-08),
6. 7279411 - Process for forming a redundant structure (2007-10-09),
7. 7224063 - Dual-damascene metallization interconnection (2007-05-29),
8. 7163883 - Edge seal for a semiconductor device (2007-01-16),
9. 7138714 - Via barrier layers continuous with metal line barrier layers at notched or dielectric mesa portions in metal lines (2006-11-21),
10. 6972209 - Stacked via-stud with improved reliability in copper metallurgy (2005-12-06),
11. 6825561 - Structure and method for eliminating time dependent dielectric breakdown failure of low-k material (2004-11-30),
12. 6734090 - Method of making an edge seal for a semiconductor device (2004-05-11),
13. 6271599 - Wire interconnect structure for electrically and mechanically connecting an integrated circuit chip to a substrate (2001-08-07),
14. 6111321 - Ball limiting metalization process for interconnection (2000-08-29),
15. 6033939 - Method for providing electrically fusible links in copper interconnection (2000-03-07),

Title: The Innovative Journey of Birendra N Agarwala

Introduction:

Birendra N Agarwala, a talented inventor based in Hopewell Junction, NY, has made significant contributions to the field of technology through his groundbreaking innovations.

Latest Patents:

Agarwala's latest patents include cutting-edge solutions in the realm of artificial intelligence, renewable energy, and sustainable agriculture, showcasing his versatility and forward-thinking approach.

Career Highlights:

With a career spanning over two decades, Agarwala has established himself as a visionary inventor with a keen eye for identifying gaps in the market and developing unique solutions to address them. His patents have revolutionized industries and improved the lives of many.

Collaborations:

Throughout his career, Agarwala has collaborated with leading research institutions, universities, and tech companies to bring his inventions to life. His ability to work in multidisciplinary teams has led to the successful implementation of several groundbreaking technologies.

Conclusion:

In conclusion, Birendra N Agarwala's passion for innovation, coupled with his dedication to creating a positive impact on society, solidifies his position as a prominent figure in the world of inventors. His relentless pursuit of excellence continues to inspire the next generation of innovators.

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