The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2008
Filed:
Jan. 04, 2007
Birendra N. Agarwala, Hopewell Junction, NY (US);
Eric M. Coker, Burlington, VT (US);
Anthony Correale, Jr., Raleigh, NC (US);
Hazara S. Rathore, Stormville, NY (US);
Timothy D. Sullivan, Underhill, VT (US);
Richard A. Wachnik, Mount Kisco, NY (US);
Birendra N. Agarwala, Hopewell Junction, NY (US);
Eric M. Coker, Burlington, VT (US);
Anthony Correale, Jr., Raleigh, NC (US);
Hazara S. Rathore, Stormville, NY (US);
Timothy D. Sullivan, Underhill, VT (US);
Richard A. Wachnik, Mount Kisco, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method for forming an interconnect structure, the interconnect structure comprising: a lower level wire having a side and a bottom, the lower level wire comprising: a lower core conductor and a lower conductive liner, the lower conductive liner on the side and the bottom of the lower level wire; an upper level wire having a side and a bottom, the upper level wire comprising an upper core conductor and an upper conductive liner, the upper conductive liner on the side and the bottom of the upper level wire; and the upper conductive liner in contact with the lower core conductor and also in contact with the lower conductive liner in a liner-to-liner contact region.