Company Filing History:

15 out of 164,108

International Business Machines Corporation

Years Active: 2006-2016

where 'Filed Patents' based on already Granted Patents

17 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 9443776 - Method and structure for determining thermal cycle reliability (2016-09-13),

2. 9287186 - Method and structure for determining thermal cycle reliability (2016-03-15),

3. 8480302 - Micro-electro-mechanical-system temperature sensor (2013-07-09),

4. 7867897 - Low leakage metal-containing cap process using oxidation (2011-01-11),

5. 7830019 - Via bottom contact and method of manufacturing same (2010-11-09),

6. 7692439 - Structure for modeling stress-induced degradation of conductive interconnects (2010-04-06),

7. 7639032 - Structure for monitoring stress-induced degradation of conductive interconnects (2009-12-29),

8. 7598614 - Low leakage metal-containing cap process using oxidation (2009-10-06),

9. 7585764 - VIA bottom contact and method of manufacturing same (2009-09-08),

10. 7511378 - Enhancement of performance of a conductive wire in a multilayered substrate (2009-03-31),

11. 7500208 - Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regime (2009-03-03),

12. 7397260 - Structure and method for monitoring stress-induced degradation of conductive interconnects (2008-07-08),

13. 7388224 - Structure for determining thermal cycle reliability (2008-06-17),

14. 7231617 - Determination of grain sizes of electrically conductive lines in semiconductor integrated circuits (2007-06-12),

15. 7166904 - Structure and method for local resistor element in integrated circuit technology (2007-01-23),

Title: The Innovations of Jason Paul Gill: Pioneering Thermal Cycle Reliability

Introduction

Jason Paul Gill, an accomplished inventor from Essex Junction, VT, has made significant contributions to the field of semiconductor reliability with his innovative solutions. With a remarkable portfolio of 17 patents, Gill's work primarily focuses on methodologies and structures that enhance the evaluation of thermal cycle reliability in semiconductor manufacturing.

Latest Patents

Among his latest patents, Gill has developed a "Method and Structure for Determining Thermal Cycle Reliability." This innovative test structure is designed to assess reliability performance through a patterned metallization structure that features multiple interfaces, which strategically act as stress risers. Surrounding the metallization structure is a dielectric material that experiences a mismatch in coefficients of thermal expansion (CTE). This important design factor generates a thermal strain value, which can lead to failures under specific stress conditions, ultimately providing insights into the manufacturing design's reliability yield. Furthermore, he has also patented a device and method to evaluate the reliability of semiconductor chip structures based on a manufacturing process. This approach includes thermal cycling of test structures and assessing yield performance to determine the reliability of the semiconductor chips before undergoing thermal cycling.

Career Highlights

Throughout his career, Jason Gill has significantly impacted the semiconductor industry while working with renowned companies such as IBM and Globalfoundries Inc. His extensive experience in these leading organizations has provided him with unique insights into the challenges and requirements of semiconductor manufacturing, further fueling his innovative spirit.

Collaborations

Gill's collaboration with notable coworkers such as Timothy Dooling Sullivan and Baozhen Li has played a pivotal role in his inventive journey. Working alongside skilled professionals in the field contributes to the brainstorming and execution of innovative ideas that continue to advance the technology surrounding semiconductor reliability.

Conclusion

Jason Paul Gill exemplifies how innovative thinking and dedication can lead to significant advancements in the semiconductor industry. His numerous patents reflect his commitment to enhancing thermal cycle reliability, making a notable difference in manufacturing processes and reliability assessments. As technology continues to evolve, Gill's contributions will undoubtedly leave a lasting impact on the field.

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